Effects of alloying elements on the high-temperature oxidation resistance and wettability of the Sn-9Zn alloy

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Pin, Zhang ^a   Hong, Guo ^a   Fubao, Yang ^a   Jun, Xu ^a  

^a GENERAL RESEARCH INSTITUTE FOR NONFERROUS METALS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING ELEMENTS; MELTING POINT; OXIDATION RESISTANCE; SOLDERING ALLOYS; THERMOGRAVIMETRIC ANALYSIS; THERMOOXIDATION; WETTING;

HIGH-TEMPERATURE OXIDATION RESISTANCE; LEAD-FREE SOLDERS; SOLDER WETTABILITY;

TIN ALLOYS;

EID: 34948850729     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359743     Document Type: Conference Paper

References (12)

1. Jenn-Ming Song, Zong-Mou Wu, "Variable eutectic temperature caused by inhomogeneous solute distribution in Sn - Zn system," Scripta Materialia, No.54 (2006), pp.1479-1483.
2. Chang-Yong Lee, Jeong-Won Yoon, Young-Jig Kim, "Interfacial reactions and joint reliability of Sn - 9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate," Microelectronic Engineering, No.82 (2005), pp.561 - 568.
3. Tao-Chih Chang, Ying-Tun Hsu, Min-Hsiung Hon Moo-Chin Wang, "Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating," Journal of Alloys and Compounds No.36(2003), pp.217-224.
4. Jenn-Ming Song, Truan-Sheng Lui, Yea-Luen Chang, Li-Hui Chen, "Compositional effects on the microstructure and vibration fracture properties of Sn-Zn-Bi alloys," Journal of Alloys and Compounds, No.403 (2005), pp.191-196.
5. Kwang-Lunglin, Kang-I Chen, "A Potential Drop-In Replacement for Eutectic Sn-Pb Solder-The Sn-Zn-Ag-Al-Ga Solder," Journal of Electronic Materials, Vol.32, No.12 (2003), pp. 1490-1495.
6. Young-Sun Kim, Keun-Soo Kim, Chi-Won Hwang, Katsuaki Suganuma, "Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys," Journal of Alloys and Compounds, 352 (2003), pp.237-245.
7. Shan-Pu Yu, Hsin-Chien Wang, Min-Hsiung Hon, Moo-Chin Wang, "Composition and heat-treatment effects on the adhesion strength of Sn-Zn-Al solders on Cu Substrate," JOM, Vol.52, No.6(2000), pp.636-39
8. C.M.L. WU, C.CM.T.LAW, "The wettability and Microstructure of Sn-Zn-Re Alloys," Journal of Electronic Materials, Vol.32, No. 2 (2003), pp 63-67.
9. Xiao-xue, Li Ming, Mao Da-li, "Effect of Alloying Elements on the High-temperature Oxidation Resistance of Sn-Zn Based Lead-free Solder," Electronic Components and Materials, Vol.23, No.11(2004)., pp.40-44.
10. D.Q. Yu, H.P. Xie, L. Wang, "Investigation of interfacial microstructure and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate," Journal of Alloys and Compounds, 385 (2004), PP.119-125.
11. Masayuki Kitajima, Tadaaki Shono, "Development of Sn-Zn-Al Lead-Free Solder Alloys," Fujitsu Science Technology Joural, Vol.41, No.2(2005), pp.225-235.
12. C.M.L. Wu, D.Q.Yu, C.M.T.Law, L.Wang, "properties of lead-free solders alloys with rare earth element additions," Materials Science and Engineering, No. 44(2004), pp. 1-44.