The design and fabrication of microlens and LED integrated packaging

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Ming, Wang ^a   Dianming, Wang ^a   Sihai, Chen ^a   Sihua, Xiang ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Integrated packaging; LED; MEMS; Microlens

Indexed keywords

ELECTRONICS PACKAGING; LIGHT EMITTING DIODES; MEMS; OPTICAL PROPERTIES;

LED INTEGRATED PACKAGING; LIGHT PROPERTIES; OPTICAL EXTRACTION EFFICIENCY;

MICROLENSES;

EID: 34948837752     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359803     Document Type: Conference Paper

References (7)

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