Stress and slurry chemistry effects on CMP damage of ultra-low-k dielectrics

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 129-131

  Kim, Taek Soo ^a   Zhong, Qiping ^b   Peterson, Maria ^b   Tam, Halbert ^c   Konno, Tomohisa ^c   Dauskardt, Reinhold H ^a  

^a Stanford University   (United States)

^b JSR Micro   (United States)

^c JSR CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CRACK PROPAGATION; DIELECTRIC MATERIALS; STRESS ANALYSIS; SURFACE ACTIVE AGENTS;

MECHANICAL LOADS; SLURRY CHEMISTRY; ULTRA-LOW-K MATERIALS;

OPTICAL INTERCONNECTS;

EID: 34748890676     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382373     Document Type: Conference Paper

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