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Volumn , Issue , 2007, Pages 2117-2120

Small form-factor integrated passive devices for SiP applications

Author keywords

EM simulation; Filter; Flip chip; Integrated passive device; System in package

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; PASSIVE NETWORKS; SILICON;

EID: 34748885547     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2007.380306     Document Type: Conference Paper
Times cited : (26)

References (8)
  • 1
    • 4444224122 scopus 로고    scopus 로고
    • High-Performance Large- Inductance Embedded Inductors in Thin Array Plastic Packaging (TAPP) for RF System-in-Package Applications
    • September
    • K. J. Chen, et al, "High-Performance Large- Inductance Embedded Inductors in Thin Array Plastic Packaging (TAPP) for RF System-in-Package Applications", IEEE Microwave and Wireless Components Letters, vol. 14, no. 9, pp. 449-451, September 2004.
    • (2004) IEEE Microwave and Wireless Components Letters , vol.14 , Issue.9 , pp. 449-451
    • Chen, K.J.1
  • 4
    • 4444361473 scopus 로고    scopus 로고
    • Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design
    • X. Huo, K. J. Chen, H. Luong and P. C. Chan, "Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design," in IEEE RFIC Symposium Digest, pp. 627-630, 2004.
    • (2004) IEEE RFIC Symposium Digest , pp. 627-630
    • Huo, X.1    Chen, K.J.2    Luong, H.3    Chan, P.C.4
  • 5
    • 0035303634 scopus 로고    scopus 로고
    • High-Performance inductors
    • April
    • I. J. Bahl, "High-Performance inductors," IEEE Trans. Microwave Theory Tech., vol. 49, pp. 654-664, April 2001.
    • (2001) IEEE Trans. Microwave Theory Tech , vol.49 , pp. 654-664
    • Bahl, I.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.