Full-circuit design optimization of a RF silicon integrated passive device

Electrical Performance of Electronic Packaging, EPEP

Volumn , Issue , 2006, Pages 327-330

  Liu, Kai ^a,b   Frye, Robert C ^a,b  

^a STATS ChipPAC   (United States)

^b RF Design Consulting LLC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT SIMULATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MULTIPLEXING EQUIPMENT; OPTICAL DESIGN; SILICON WAFERS;

(100) SILICON; (E ,3E) PROCESS; CIRCUIT DESIGNS; COMPONENT VALUES; DIPLEXER; ELECTRICAL PERFORMANCES; ELECTROMAGNETIC (EM); ELECTRONIC PACKAGING; HYBRID OPTIMIZATION; INTEGRATED PASSIVE DEVICE (IPD); PHYSICAL DESIGNS; SIMULATION AND OPTIMIZATION;

OPTIMIZATION;

EID: 34748847738     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2006.321244     Document Type: Conference Paper

References (4)

1. R. Frye, K. Tai, M. Lau and A. Lin, "Silicon-on-Silicon MCMs with Integrated Passive Components," Proc. IEEE Multi-Chip Module Conference, 155-158, 1992.
2. P. Pieters, S. Brebels and E. Beyne, "Integrated Microwave Filters in MCM-D," Proc. IEEE Muli-Chip Module Conference, 61-66, 1996.
3. N. Klemmer and J. Härtung, "High Q Inductors for MCM-Si Technology," Proc. IEEE Muli-Chip Module Conference, 33-37, 1997.
4. S. Kapur and D. Long, "Large-Scale Full-Wave Simulation," Proc. 41st Design Automation Conference, 806-809, San Diego, CA, June 7-11, 2004.