High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications

IEEE Microwave and Wireless Components Letters

Volumn 14, Issue 9, 2004, Pages 449-451

  Chen, Kevin J ^a   Chan, Kwok Wai ^a   Wong, Michael K W ^b   Fok, Norman M K ^b   Kwan, Kenneth K P ^b   Fan, Nelson C H ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASAT   (Hong Kong)

^c NONE

Author keywords

Embedded inductors; High Q; Mold compound; System in package (SIP); Thin array plastic packaging

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIELECTRIC LOSSES; ELECTRIC CONDUCTIVITY; GLASS TRANSITION; LOCAL AREA NETWORKS; MULTILAYERS; NATURAL FREQUENCIES; SURFACE MOUNT TECHNOLOGY; TRANSISTORS; WIRELESS TELECOMMUNICATION SYSTEMS;

EMBEDDED INDUCTORS; HIGH-Q; MOLD COMPOUND; SYSTEM-IN-PACKAGE (SIP); THIN ARRAY PLASTIC PACKAGING (TAAP); WIRELESS LOCAL AREA NETWORK (WLAN);

ELECTRIC INDUCTORS;

EID: 4444224122     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2004.832082     Document Type: Article

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