Copper stress migration at narrow metal finger with wide lead

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2697-2701

  Wang, Robin C J ^a,b   Chang Liao, K S ^a   Oates, A S ^b   Lee, C C ^b   Chen, L D ^b   Chiu, C C ^b   Wu, Kenneth ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Backend of line (BEOL); Finite element analysis (FEA); Stress migration (SM)

Indexed keywords

COPPER ALLOYS; FINITE ELEMENT METHOD; LEAD; RELIABILITY;

BACKEND-OF-LINE (BEOL); METAL GEOMETRIC FACTORS; NARROW METAL FINGER; STRESS MIGRATION (SM);

ELECTROMIGRATION;

EID: 34548840809     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.035     Document Type: Article

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