NiSi contact metallization using electroless Ni deposition on Pd-activated self-assembled monolayer (SAM) on p-type Si(1 0 0)

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2506-2510

  Duhin, A ^a   Sverdlov, Y ^a   Torchinsky, I ^a   Feldman, Yishay ^b   Shacham Diamand, Y ^a  

^a TEL AVIV UNIVERSITY   (Israel)

^b WEIZMANN INSTITUTE OF SCIENCE   (Israel)

Author keywords

Electroless; NiSi; Self Assembled Monolayer

Indexed keywords

ANNEALING; ELECTROLESS PLATING; THERMAL EFFECTS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

NICKEL DEPOSITIONS; X-RAY PHOTON SPECTROSCOPY (XPS) PROFILING;

METALLIZING;

EID: 34548828237     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.067     Document Type: Article

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