Evaluation on the characteristics of tin-silver-bismuth solder

Journal of Materials Engineering and Performance

Volumn 11, Issue 1, 2002, Pages 107-111

  Xia, Z ^a   Shi, Y ^a   Chen, Z ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Mechanical property; Physical property; Spreading behavior; Tin silver bismuth solder

Indexed keywords

COOLING; COPPER; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; FLUXES; FRACTURE; INTERMETALLICS; MECHANICAL PROPERTIES; PHYSICAL PROPERTIES; TENSILE STRENGTH; TIN ALLOYS;

COEFFICIENCY OF THERMAL EXPANSION; COOLING CURVES; FRACTURE ENERGY; ROSIN-BASED MILDLY ACTIVATED FLUX; TIN SILVER BISMUTH SOLDER;

SOLDERING ALLOYS;

EID: 0036466254     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994902770344475     Document Type: Article

References (10)

1. Examining the environmental impact of lead-free soldering alternatives
2. A viable tin-lead solder substitute: Sn-Ag-Cu
3. Get the lead out
4. Fujitsu targets 2002 for eliminating of lead from products
5. Issues in the replacement of lead-bearing solders
6. New lead-free Sn-Ag-Zn-Cu solder alloy with improved mechanical properties
7. Mechanical fatigue characteristic of Sn-3.5Ag-X(X = Bi, Cu, Zn, and In) solder alloys
8. A thorough look at lead-free solder alternatives
9. Converting to lead-free solders: An automotive industry perspective