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Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1523-1528

Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; ELECTRON MICROSCOPY; FAILURE ANALYSIS; FOCUSED ION BEAMS; INTEGRATED CIRCUIT TESTING; NONDESTRUCTIVE EXAMINATION;

EID: 34548686109     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.07.082     Document Type: Article
Times cited : (7)

References (7)
  • 1
    • 1542330226 scopus 로고    scopus 로고
    • Coaxial, photon-ion technology enables direct navigation to buried nodes on planarized surfaces, including silicon
    • Thompson M.A., Richardson C., Le Roy E., Lundquist T., and Thompson W.B. Coaxial, photon-ion technology enables direct navigation to buried nodes on planarized surfaces, including silicon. Proc 28th ISTFA (2002) 409
    • (2002) Proc 28th ISTFA , pp. 409
    • Thompson, M.A.1    Richardson, C.2    Le Roy, E.3    Lundquist, T.4    Thompson, W.B.5
  • 2
    • 24144491329 scopus 로고    scopus 로고
    • Electrical performance evaluation of FIB edited circuits through chip backside exposing shallow trench isolations
    • Schlangen R., Kerst U., Kabakow A., and Boit C. Electrical performance evaluation of FIB edited circuits through chip backside exposing shallow trench isolations. Proc 16th ESREF (2005) 1544
    • (2005) Proc 16th ESREF , pp. 1544
    • Schlangen, R.1    Kerst, U.2    Kabakow, A.3    Boit, C.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.