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Volumn 47, Issue 9-11 SPEC. ISS., 2007, Pages 1523-1528
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Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy
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Author keywords
[No Author keywords available]
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Indexed keywords
BACKSCATTERING;
ELECTRON MICROSCOPY;
FAILURE ANALYSIS;
FOCUSED ION BEAMS;
INTEGRATED CIRCUIT TESTING;
NONDESTRUCTIVE EXAMINATION;
BACKSCATTERED ELECTRON MICROSCOPY;
CHIP INSPECTION;
CHIP SCALE PACKAGES;
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EID: 34548686109
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/j.microrel.2007.07.082 Document Type: Article |
Times cited : (7)
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References (7)
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