Interaction of Cu atoms with ordered 2D oligopyridine networks

Surface Science

Volumn 601, Issue 18, 2007, Pages 4200-4205

  Breitruck, A ^a   Hoster, H E ^a   Meier, C ^a   Ziener, U ^a   Behm, R J ^a  

^a UNIVERSITY OF ULM   (Germany)

Author keywords

HOPG; Metal ligand interactions; Metal organic network; Oligopyridine; Scanning tunneling microscopy; Self assembly

Indexed keywords

ANNEALING; COPPER; DEPOSITION; DIMERS; LIGANDS; SCANNING TUNNELING MICROSCOPY; SELF ASSEMBLY; ULTRAHIGH VACUUM;

METAL LIGAND INTERACTIONS; METAL ORGANIC NETWORKS; METAL ORGANIC STRUCTURE; OLIGOPYRIDINE NETWORKS;

ORGANOMETALLICS;

EID: 34548647980     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2007.04.173     Document Type: Article

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