Electromigration reliability enhancement of flip chip interconnects using Cu-doped SnPb solder

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2004, Pages 565-566

  Wu, J D ^a   Lee, C W ^a   Wu, S V ^a   Li, Simon ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Flip chip interconnects; SnPbCu SnPbNi solders; Under bump metallization

Indexed keywords

COPPER; DOPING (ADDITIVES); ELECTROMIGRATION; METALLIZING; MICROPROCESSOR CHIPS; RELIABILITY; SOLDERING ALLOYS;

EUTECTIC SOLDERS; FLIP CHIP INTERCONNECTS; METAL TRACE; UNDER BUMP METALLIZATION;

FLIP CHIP DEVICES;

EID: 3042563206     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. The International Technology Roadmap for Semiconductor, 1999.
2. S. Brandenberg, and S. Yeh, Surface Mount International Conference and Exposition, SMI 98 Proceedings, 1998.
3. T.Y. Lee, K.N. Tu, S.M. Kuo, and D.R. Frear, "Electromigration of Eutectic SnPb Solder Interconnects for Flip Chip Technology," J. Appl. Phys. 89, 6, 2001.
4. W.J. Choi, E.C.C. Yeh, and K.N. Tu, "Electromigration of Flip-Chip Solder Bump on Cu/Ni(V)/Al Thin Film Under Bump Metallization," 2002 Electronic Components and Technology Conference.
5. J.D. Wu, P.J. Zheng, Kelly Lee, C.T. Chiu, and J.J. Lee, "Electromigration Failures of UBM/Bump Systems of Flip-Chip Packages," 2002 Electronic Components and Technology Conference.
6. J.D. Wu, P.J. Zheng, C.W. Lee, S.C. Hung, and J.J. Lee, "A Study in Flip-Chip UBM/Bump Reliability with Effects of SnPb Solder Composition," 2003 International Reliability Physics Symposium (IRPS).