Self-assembly of three dimensional micro mechanisms using thermal shrinkage of polyimide

Microsystem Technologies

Volumn 13, Issue 8-10, 2007, Pages 1047-1053

  Suzuki, Kenji ^a   Yamada, Hideaki ^a   Miura, Hirofumi ^a   Takanobu, Hideaki ^a  

^a KOGAKUIN UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CCD CAMERAS; MICROMACHINING; MICROSTRUCTURE; SELF ASSEMBLY; SHRINKAGE; THREE DIMENSIONAL;

BENDING ANGLE; HINGED STRUCTURES; MICRO MECHANISMS; PRECISE CONTROL; WAFER PLANE;

POLYIMIDES;

EID: 34548240718     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0303-z     Document Type: Conference Paper

References (10)

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