SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Volumn 7, Issue 9, 2007, Pages 1198-1201

A simple polysilsesquioxane sealing of nanofluidic channels below 10 nm at room temperature

(5) Gu, Jian a Gupta, Ravi a Chou, Chia Fu a Wei, Qihuo a Zenhausern, Frederic a,b

a ARIZONA STATE UNIVERSITY (United States)

b Arizona State University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DNA FRAGMENT; GLASS; NANOCHANNEL; POLYSILSESQUIOXANE; SEALANT; UNCLASSIFIED DRUG;

ARTICLE; FILM; NANOFLUIDICS; PLASMA; PRIORITY JOURNAL; ROOM TEMPERATURE;

EID: 34548104880 PISSN: 14730197 EISSN: 14730189 Source Type: Journal
DOI: 10.1039/b704851c Document Type: Article

Times cited : (52)

References (24)

1
- 0038632924
- O. A. Saleh L. L. Sohn Nano Lett. 2003 3 37
- (2003) Nano Lett. , vol.3 , pp. 37
- Saleh, O.A.¹ Sohn, L.L.²

2
- 7044265023
- P. M. Sinha G. Valco S. Sharma X. Liu M. Ferrari Nanotechnology 2004 15 S585
- (2004) Nanotechnology , vol.15 , pp. 585
- Sinha, P.M.¹ Valco, G.² Sharma, S.³ Liu, X.⁴ Ferrari, M.⁵

3
- 0034640410
- J. Han H. G. Craighead Science 2000 288 1026
- (2000) Science , vol.288 , pp. 1026
- Han, J.¹ Craighead, H.G.²

4
- 24744433042
- Y. C. Wang A. L. Stevens J. Han Anal. Chem. 2005 77 4293
- (2005) Anal. Chem. , vol.77 , pp. 4293
- Wang, Y.C.¹ Stevens, A.L.² Han, J.³

5
- 0032403465
- D. C. Duffy J. C. McDonald O. J. A. Schueller G. M. Whitesides Anal. Chem. 1998 70 4974
- (1998) Anal. Chem. , vol.70 , pp. 4974
- Duffy, D.C.¹ McDonald, J.C.² Schueller, O.J.A.³ Whitesides, G.M.⁴

6
- 0035894044
- O. Bakajin T. A. J. Duke J. Tegenfeldt C. F. Chou S. S. Chan R. H. Austin E. C. Cox Anal. Chem. 2001 73 6053
- (2001) Anal. Chem. , vol.73 , pp. 6053
- Bakajin, O.¹ Duke, T.A.J.² Tegenfeldt, J.³ Chou, C.F.⁴ Chan, S.S.⁵ Austin, R.H.⁶ Cox, E.C.⁷

7
- 3142738679
- L. C. Campbell M. J. Wilkinson A. Manz P. Camilleri C. J. Humphreys Lab Chip 2004 4 225
- (2004) Lab Chip , vol.4 , pp. 225
- Campbell, L.C.¹ Wilkinson, M.J.² Manz, A.³ Camilleri, P.⁴ Humphreys, C.J.⁵

8
- 23644452355
- P. Mao J. Han Lab Chip 2005 5 837
- (2005) Lab Chip , vol.5 , pp. 837
- Mao, P.¹ Han, J.²

9
- 0031370110
- H. Y. Wang R. S. Foote S. C. Jacobson J. H. Schneibel J. M. Ramsey Sens. Actuators, B 1997 45 199
- (1997) Sens. Actuators, B , vol.45 , pp. 199
- Wang, H.Y.¹ Foote, R.S.² Jacobson, S.C.³ Schneibel, J.H.⁴ Ramsey, J.M.⁵

10
- 28944433175
- H. Wu B. Huang R. N. Zare Lab Chip 2005 5 1393
- (2005) Lab Chip , vol.5 , pp. 1393
- Wu, H.¹ Huang, B.² Zare, R.N.³

11
- 0842287340
- L. J. Guo X. Cheng C. F. Chou Nano Lett. 2004 4 69
- (2004) Nano Lett. , vol.4 , pp. 69
- Guo, L.J.¹ Cheng, X.² Chou, C.F.³

12
- 33947660099
- P. Abgrall L.-N. Low N.-T. Nguyen Lab Chip 2007 7 520
- (2007) Lab Chip , vol.7 , pp. 520
- Abgrall, P.¹ Low, L.-N.² Nguyen, N.-T.³

13
- 33750447241
- P. Kim H. E. Jeong A. Khademhosseini K. Y. Suh Lab Chip 2006 6 1432
- (2006) Lab Chip , vol.6 , pp. 1432
- Kim, P.¹ Jeong, H.E.² Khademhosseini, A.³ Suh, K.Y.⁴

14
- 1542583741
- R. H. Baney M. Itoh A. Sakakibara T. Suzuki Chem. Rev. 1995 95 1409
- (1995) Chem. Rev. , vol.95 , pp. 1409
- Baney, R.H.¹ Itoh, M.² Sakakibara, A.³ Suzuki, T.⁴

15
- 0033116845
- N. Takamura T. Gunji H. Hatano Y. Abe J. Polym. Sci., Part A: Polym. Chem. 1999 37 1017
- (1999) J. Polym. Sci., Part A: Polym. Chem. , vol.37 , pp. 1017
- Takamura, N.¹ Gunji, T.² Hatano, H.³ Abe, Y.⁴

16
- 0033742531
- H. Schmid B. Michel Macromolecules 2000 33 3042
- (2000) Macromolecules , vol.33 , pp. 3042
- Schmid, H.¹ Michel, B.²

17
- 79956006132
- H. Cao J. O. Tegenfeldt R. H. Austin S. Y. Chou Appl. Phys. Lett. 2002 81 3058
- (2002) Appl. Phys. Lett. , vol.81 , pp. 3058
- Cao, H.¹ Tegenfeldt, J.O.² Austin, R.H.³ Chou, S.Y.⁴

18
- 22444435567
- S. Bhattacharya A. Datta J. M. Berg S. Gangopadhyay J. Microelectromech. Syst. 2005 14 590
- (2005) J. Microelectromech. Syst. , vol.14 , pp. 590
- Bhattacharya, S.¹ Datta, A.² Berg, J.M.³ Gangopadhyay, S.⁴

19
- 0004050161
- John Wiley & Sons, New York
- Q. Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology, John Wiley & Sons, New York, 1999
- (1999) Semiconductor Wafer Bonding: Science and Technology
- Tong, Q.Y.¹ Gösele, U.²

20
- 85022107367
- J. Gu, unpublished work
- Gu Unpublished Work, J.¹

21
- 0141955846
- R. H. Austin Nat. Mater. 2003 2 567
- (2003) Nat. Mater. , vol.2 , pp. 567
- Austin, R.H.¹

22
- 36749109216
- P. G. De Gennes J. Chem. Phys. 1974 60 5030
- (1974) J. Chem. Phys. , vol.60 , pp. 5030
- De Gennes, P.G.¹

23
- 33846196295
- K. Haubert T. Drier D. Beebe Lab Chip 2006 6 1548
- (2006) Lab Chip , vol.6 , pp. 1548
- Haubert, K.¹ Drier, T.² Beebe, D.³

24
- 33744786540
- G. M. Schmid M. D. Stewart J. Wetzel F. Palmieri J. Hao Y. Nishimura K. Jen E. K. Kim D. J. Resnick J. A. Liddle C. G. Willson J. Vac. Sci. Technol., B 2006 24 1283
- (2006) J. Vac. Sci. Technol., B , vol.24 , pp. 1283
- Schmid, G.M.¹ Stewart, M.D.² Wetzel, J.³ Palmieri, F.⁴ Hao, J.⁵ Nishimura, Y.⁶ Jen, K.⁷ Kim, E.K.⁸ Resnick, D.J.⁹ Liddle, J.A.¹⁰ Willson, C.G.¹¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.