A study on improvement of interfacial adhesion energy of inkjet-printed Ag thin film on polyimide by CF4 plasma treatment

Korean Journal of Materials Research

Volumn 17, Issue 4, 2007, Pages 215-221

  Park, Sung Cheol ^a   Cho, Su Hwan ^b   Jung, Hyun Cheol ^b   Joung, Jae Woo ^b   Park, Young Bae ^a  

^a Andong National University   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Adhesion; Inkjet printed Ag; Peel test; Polyimide; Thin film

Indexed keywords

EID: 34548029210     PISSN: 12250562     EISSN: None     Source Type: Journal    
DOI: 10.3740/MRSK.2007.17.4.215     Document Type: Article

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