Theory and experiment on hydrodynamic suspension ultra-smooth machining for silicon wafers

Guangxue Jingmi Gongcheng/Optics and Precision Engineering

Volumn 15, Issue 7, 2007, Pages 1084-1089

  Cao, Zhi Qiang ^a   Zhao, Ji ^a   Chen, De Xiang ^a   Zhang, Fu ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Hydrodynamic suspension; Removal mechanism; Silicon wafer; Ultra smooth machining

Indexed keywords

HYDRODYNAMICS; MACHINING; PLASTIC DEFORMATION; SURFACE ROUGHNESS;

ABRASIVE PARTICLE; HYDRODYNAMIC SUSPENSION; MACHINING TIME; MOTOR ROTATE; REMOVAL MECHANISM; ULTRASMOOTH MACHINING;

SILICON WAFERS;

EID: 34547979132     PISSN: 1004924X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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