Research on surface topography of silicon wafer in chemical-mechanical polishing

Run Hua Yu Mi Feng/Lubrication Engineering

Volumn , Issue 2, 2006, Pages

  Wang, Liangliang ^a   Lu, Xinchun ^a   Pan, Guoshun ^a   Huang, Yi ^a   Luo, Jianbin ^a   Lei, Hong ^b  

^a TSINGHUA UNIVERSITY   (China)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

Chemical mechanical polishing; Silicon; Topography

Indexed keywords

ALKALINITY; CONCENTRATION (PROCESS); SILICON WAFERS; SLURRIES; SURFACE ROUGHNESS; SURFACE TOPOGRAPHY;

GEOMETRICAL FEATURES; ORANGE PEEL; PARTICLE SIZE; UNDULATIONS;

CHEMICAL MECHANICAL POLISHING;

EID: 33646384619     PISSN: 02540150     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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