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Volumn 46, Issue 3 A, 2007, Pages 977-979

A new cerium-based ternary oxide slurry, CeTi2O6, for chemical-mechanical polishing

Author keywords

Brannerite structure; Ceria (CeO2); CeTi2O6; Chemical mechanical polishing (CMP); Pechini polymerizable complex method; Removal rate

Indexed keywords

ABRASIVES; CERIUM COMPOUNDS; CHEMICAL MECHANICAL POLISHING; OXIDES; RIETVELD ANALYSIS; X RAY DIFFRACTION;

BRANNERITE STRUCTURE; PECHINI POLYMERIZABLE COMPLEX METHOD; REMOVAL RATE;

TERNARY SYSTEMS;

EID: 34547876199 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/JJAP.46.977 Document Type: Article

Times cited : (18)

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