Effect of abrasive in Cu-CMP slurry on global planarization

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 107-111

  Nomura, Yutaka ^a   Ono, Hiroshi ^a   Terazaki, Hiroki ^a   Kamigata, Yasuo ^a   Yoshida, Masato ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVES; ADSORPTION; CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROPHORESIS; HYDROGEN PEROXIDE; MATHEMATICAL MODELS; STRENGTH OF MATERIALS;

ABRASIVE-FREE POLISHING (AFP); ABRASIVE-FREE-LIKE (AFL) SLURRY; BLANKET WAFERS; GLOBAL PLANARIZATION;

SLURRIES;

EID: 12744263654     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-816-k4.5     Document Type: Conference Paper

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