Effect of Ceria Particle-Size Distribution and Pressure Interactions in Chemo-Mechanical Polishing (CMP) of Dielectric Materials

Materials Research Society Symposium - Proceedings

Volumn 767, Issue , 2003, Pages 153-160

  Chandrasekaran, Naga ^a   Taylor, Ted ^a   Sabde, Gundu ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERIUM COMPOUNDS; DIELECTRIC MATERIALS; PARTICLE SIZE ANALYSIS; SURFACE ROUGHNESS;

SURFACE GENERATION MECHANISMS;

CHEMICAL MECHANICAL POLISHING;

EID: 0242322627     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-767-f3.2     Document Type: Conference Paper

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