Molecular dynamics simulations of organic polymer dry etching at high substrate temperatures

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 4 A, 2007, Pages 1692-1699

  Yamashiro, Masashi ^a   Yamada, Hideaki ^b   Hamaguchi, Satoshi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Deposition; Etching; Hydrocarbon; Ion beam; MD simulation; Polymer

Indexed keywords

COMPUTER SIMULATION; DRY ETCHING; MOLECULAR DYNAMICS; SUBSTRATES; THERMAL EFFECTS; VAN DER WAALS FORCES;

HIGH SUBSTRATE TEMPERATURES; HYDROGEN ATOMS; MOLECULAR DYNAMICS SIMULATIONS; SUBSTRATE SURFACES;

ORGANIC POLYMERS;

EID: 34547864298     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.1692     Document Type: Article

References (16)

1. S. Hamaguchi: IBM J. Res. Dev. 43 (1999) 199.
2. T. J. Licata, E. G. Colgan, J. M. Haiper, and S. E. Luce: IBM J. Res. Dev. 39 (1995) 419.
3. S. M. Rossnagel: J. Vac. Sci. Technol. B 13 (1995) 125.
4. H. Nagai, S. Takashima, M. Hiramatsu, M. Hori, and T. Goto: J. Appl. Phys. 91 (2002) 2615.
5. H. Nagai, M. Hiramatsu, M. Hori, and T. Goto: Jpn. J. Appl. Phys. 42 (2003) 212.
6. H. Nagai, M. Hiramatsu, M. Hori, and T. Goto: J. Appl. Phys. 94 (2003) 1362.
7. K. Kurihara, A. Egami, and M. Nakamura: J. Appl. Phys. 98 (2005) 084907.
8. H. Yamada and S. Hamaguchi: J. Appl. Phys. 96 (2004) 6147.
9. H. Yamada and S. Hamaguchi: Plasma Phys. Control. Fusion 47 (2005) A11.
10. M. Yamashiro, H. Yamada, and S. Hamaguchi: to be published in J. Appl. Phys. (2007).
11. B. C. Dems and F. Rodriguez: J. Vac. Sci. Technol. B 8 (1990) 1985.
12. R. R. A. Callahan, G. B. Raupp, and S. P. Beaudoin: J. Vac. Sci. Technol. B 19 (2001) 725.
13. D. W. Brenner: Phys. Rev. B 42 (1990) 9458.
14. S. B. Sinnott, A. Shenderova, C. T. Whiter, and D. W. Brenner: Carbon 36 (1998) 1.
15. P. Pradere and A. Boudet: J. Mater. Sci. 22 (1987) 4240.
16. H. Ohta and S. Hamaguchi: J. Vac. Sci. Technol. A 19 (2001) 2373.