Micromechanical characterization of electroplated permalloy films for MEMS

Microsystem Technologies

Volumn 14, Issue 1, 2008, Pages 131-134

  Li, Xueping ^a   Ding, Guifu ^a   Ando, Taeko ^b   Shikida, Mitsuhiro ^b   Sato, Kazuo ^b  

^a Shanghai Jiao Tong University   (China)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELECTROPLATED PRODUCTS; LOGIC DESIGN; MEMS; MICROMECHANICS; RELIABILITY ANALYSIS; TENSILE STRENGTH;

GAUGE SECTION; MICROSCALE ELECTROPLATED PERMALLOYS; PERMALLOY FILMS;

THIN FILMS;

EID: 34547842548     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0408-z     Document Type: Article

References (8)

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