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Volumn 201, Issue 22-23 SPEC. ISS., 2007, Pages 9269-9274
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Low-k dielectrics on base of silicon carbon nitride films
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Author keywords
Electrophysical characteristics; Low k dielectrics; Optical properties; PECVD; Silicon carbonitride films
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Indexed keywords
DIELECTRIC MATERIALS;
ENERGY GAP;
MECHANICAL PROPERTIES;
MICROHARDNESS;
OPTICAL PROPERTIES;
PERMITTIVITY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICON COMPOUNDS;
LOW TEMPERATURE FILMS;
LOW-K DIELECTRICS;
SILICON CARBONITRIDE FILMS;
THIN FILMS;
DIELECTRIC MATERIALS;
ENERGY GAP;
MECHANICAL PROPERTIES;
MICROHARDNESS;
OPTICAL PROPERTIES;
PERMITTIVITY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SILICON COMPOUNDS;
THIN FILMS;
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EID: 34547799643
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2007.04.046 Document Type: Article |
Times cited : (43)
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References (13)
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