60 GHz multi-chip module based on cost effective hybrid multilayer PWB

Microwave and Optical Technology Letters

Volumn 49, Issue 9, 2007, Pages 2303-2305

  Choi, Sung Tae ^a   Hamaguchi, Kiyoshi ^a   Ogawa, Hiroyo ^a   Tokuda, Kiyohito ^b   Kim, Yong Hoon ^c  

^a NATIONAL INSTITUTE OF INFORMATION AND COMMUNICATIONS TECHNOLOGY   (Japan)

^b OKI ELECTRIC INDUSTRY CO   (Japan)

^c Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Interconnections; Millimeter wave; Multi chip module (MCM); Multilayer printed wiring board (PWB); Via holes

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; MILLIMETER WAVE DEVICES; NATURAL FREQUENCIES; OPTICAL WAVEGUIDES; PRINTED CIRCUIT BOARDS;

MULTI-CHIP MODULE (MCM); MULTILAYER PRINTED WIRING BOARD (PWB);

MULTILAYERS;

EID: 34547659224     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.22719     Document Type: Article

References (10)

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