Broadband dual-via architectures for multilayer PCB signal injection and intra-layer transition

IEEE MTT-S International Microwave Symposium Digest

Volumn 2005, Issue , 2005, Pages 853-856

  Metz, Carsten ^a   Baras, Torben ^b   Lyons, Alan ^a  

^a LUCENT TECHNOLOGIES   (United States)

^b HAMBURG UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Combiner; Divider; Multilayer circuit boards; Stub resonance; Vias

Indexed keywords

BROADBAND NETWORKS; POWER AMPLIFIERS; PRINTED CIRCUIT BOARDS; RESONANCE; SIGNAL PROCESSING;

MULTILAYER CIRCUIT BOARDS; POWER COMBINER; POWER DIVIDER; STUB RESONANCE;

ELECTRIC LINES;

EID: 33749244983     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2005.1516752     Document Type: Conference Paper

References (2)

1. T. Kushta, K. Narita, T. Kaneko, T. Saeki, and H. Tohya, "Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs," IEEE Microwave and Wireless Components Letters, vol. 13, no. 5, pp. 169 -171, 2003.
2. J. Clink, "Maximizing 10Gbps transmission path length in copper backplanes with and without transceiver technology," DesignCon, High Performance System Design Conference, 2002.