MCM-D/L technology for realization of low cost system-on-package concept at 60-80 GHz

Conference Proceedings - 33rd European Microwave Conference, EuMC 2003

Volumn 3, Issue , 2003, Pages 963-966

  Grzyb, Janusz ^a   Klemm, Maciej ^a   Troster G ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANTENNA ARRAYS; BANDPASS FILTERS; CHIP SCALE PACKAGES; LIQUID CRYSTALS; SUBSTRATES; TANTALUM OXIDES; VOLTAGE DIVIDERS;

BRANCH LINE COUPLERS; DISTRIBUTED PASSIVES; FULL-WAVE SIMULATIONS; INTEGRATION TECHNOLOGIES; MICROSTRIP CONFIGURATION; SYSTEM-ON-PACKAGE; TRANSMISSION MEDIA; WILKINSON POWER DIVIDERS;

TECHNOLOGY;

EID: 84897489664     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2003.177641     Document Type: Conference Paper

References (6)

1. LIPS, "Low Cost Interconnect, Packaging and Subsystem Integration Technologies for Millimetre-Wave Applications" http://www.ife.ee.ethz.ch/ lips/
2. LAP, " Low Cost Large Area Panel Processing of MCM-D Substrates and Packages" http://www.ife.ee.etliz.ch/hdp/lap/
3. th IEEE Top. Meet. Electrical Performance of Electronic Packaging 2002, pp. 51-54, Monterey, CA, USA.
4. th IEEE Top. Meet. Electrical Performance of Electronic Packaging 2002, pp. 55-58, Monterey, CA, USA.
5. st Electronic Components & Technology" Conf. 2002, pp. 1051-1057, San Diego, Ca, USA.
6. nd EuMW Conf. 2002, pp. 1069-1073, Milan, Italy.