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Volumn 22, Issue 8, 2007, Pages 941-946

Unveiling the electromigration physics of ULSI interconnects through statistics

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; INTERCONNECTION NETWORKS; STATISTICAL METHODS; ULSI CIRCUITS;

EID: 34547420630     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/22/8/020     Document Type: Article
Times cited : (5)

References (13)
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  • 6
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    • Electromigration in ULSI Interconnects
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  • 7
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    • Electromigration induced aluminum atom migration retarding by grain boundary structure stabilization and copper doping
    • Hasunuma M, Toyoda H and Kaneko H 1999 Electromigration induced aluminum atom migration retarding by grain boundary structure stabilization and copper doping Microelectron. Reliab. 39 1631-45
    • (1999) Microelectron. Reliab. , vol.39 , Issue.11 , pp. 1631-1645
    • Hasunuma, M.1    Toyoda, H.2    Kaneko, H.3
  • 8
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    • A new look at the statistical model identification
    • Akaike H 1974 A new look at the statistical model identification IEEE Trans. Autom. Control 6 716-23
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    • Dempster, A.P.1    Laird, N.M.2    Rubin, D.B.3
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    • Maximum likelihood estimates, from censored data, for mixed-Weibull distributions
    • Jiang S and Kececioglu D 1992 Maximum likelihood estimates, from censored data, for mixed-Weibull distributions IEEE Trans. Reliab. 41 248-55
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    • Jiang, S.1    Kececioglu, D.2
  • 11
    • 4544325099 scopus 로고    scopus 로고
    • Reliability improvement in Al metallization-a combination of statistical prediction and failure analytical methodology
    • Zhang G et al 2004 Reliability improvement in Al metallization-a combination of statistical prediction and failure analytical methodology Microelectron. Reliab. 44 1843-8
    • (2004) Microelectron. Reliab. , vol.44 , Issue.9-11 , pp. 1843-1848
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  • 12
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    • Threshold electromigration failure time and its statistics for Cu interconnects
    • Li B, Christiansen C, Gill J and Sullivan T 2006 Threshold electromigration failure time and its statistics for Cu interconnects J. Appl. Phys. 100 114516
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.