Through-substrate interconnects for 3-D ICs, RF systems, and MEMS

2007 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, SiRF07

Volumn , Issue , 2007, Pages 154-157

  Wu, Joyce H ^a   Del Alamo, Jesús A ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GROUND INDUCTANCE; SYSTEM-ON-CHIP APPLICATIONS; THROUGH-WAFER INTERCONNECTS;

CAPACITANCE; CIRCUIT SIMULATION; EQUIVALENT CIRCUITS; INDUCTANCE; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MEMS;

WSI CIRCUITS;

EID: 34547365143     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SMIC.2007.322804     Document Type: Conference Paper

References (8)

1. K. Banerjee, S. J. Souri, P. Kapur and K. C. Saraswat, Proc. IEEE, vol., 89, no. 5, pp. 602-633, 2001.
2. A. Matsuzawa, IEEE Trans. Microwave Theory and Techniques, vol. 50, no. 1, pp. 245-253, 2002.
3. S. J. Ok, IEEE Trans. Adv. Packaging, vol. 26, no. 3, pp.302-309, 2003.
4. International Technology Roadmap for Semiconductors, 2005.
5. J. H. Wu, J. A. del Alamo, K. A. Jenkins, IEDM, pp. 477-480, 2000.
6. J. H. Wu, J. A. del Alamo, IEEE Trans. Electron Devices, vol. 51, no. 11, pp. 1765-1771, 2004.
7. J. H. Wu, J. A. del Alamo, RFIC Symp., pp. 635-638, 2004.
8. D. K. Su, M. J. Loinaz, S. Masui and B. A. Wooley, J. Solid-State Circuits, vol. 28, no. 4, pp. 420-430, 1993.