Investigation of the mechanical properties of DGEBA-based epoxy resin with nanoclay additives

Composite Structures

Volumn 75, Issue 1-4, 2006, Pages 514-519

  Qi, B ^a   Zhang, Q X ^b   Bannister, M ^a   Mai, Y W ^b  

^a Australian Computer Society Inc   (Australia)

^b Center for Advanced Materials Technology (CAMT)   (Australia)

Author keywords

Clays; Elastic modulus; Epoxy; Failure strain; KIC; Nanocomposites; Stress intensity factor; Tensile strength

Indexed keywords

CLAY; ELASTIC MODULI; ETHERS; FAILURE (MECHANICAL); FRACTURE TOUGHNESS; NANOSTRUCTURED MATERIALS; STRESS INTENSITY FACTORS; TENSILE STRENGTH;

DIETHYLTOLUENE DIAMINE (DETDA); DIGLYCIDYL ETHER OF BISPHENOL A (DGEBA); NANOCLAY ADDITIVES;

EPOXY RESINS;

ADDITIVE; ELASTIC MODULUS; EPOXY RESIN; FRACTURE; MECHANICAL PROPERTY; NANOCOMPOSITE; POLYMERIZATION; TOUGHNESS;

EID: 33745748307     PISSN: 02638223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compstruct.2006.04.032     Document Type: Article

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