AFM measurements of interactions between CMP slurry particles and substrate

Journal of the Electrochemical Society

Volumn 154, Issue 6, 2007, Pages

  Burtovyy, Ruslan ^a,b   Liu, Yong ^a   Zdyrko, Bogdan ^a   Tregub, Alex ^c   Moinpour, Mansour ^c   Buehler, Mark ^c   Luzinov, Igor ^a  

^a South   (United States)

^b INSTITUTE OF PHYSICAL CHEMISTRY   (Poland)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; POLYMER FILMS; SILICON WAFERS; SUBSTRATES;

ADHESION MEASUREMENTS; VOLUME MODES;

SLURRIES;

EID: 34547156734     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2718480     Document Type: Article

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