AFM measurements of interactions between CMP slurry particles and substrate

Journal of the Electrochemical Society

Volumn 154, Issue 6, 2007, Pages

  Burtovyy, Ruslan ^a,b   Liu, Yong ^a   Zdyrko, Bogdan ^a   Tregub, Alex ^c   Moinpour, Mansour ^c   Buehler, Mark ^c   Luzinov, Igor ^a  

^a Clemson University   (United States)

^b INSTITUTE OF PHYSICAL CHEMISTRY   (Poland)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; POLYMER FILMS; SILICON WAFERS; SUBSTRATES;

ADHESION MEASUREMENTS; VOLUME MODES;

SLURRIES;

EID: 34547156734     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2718480     Document Type: Article

References (42)

1. F. Zhang and A. Busnaina, Electrochem. Solid-State Lett., 1, 184 (1998).
2. F. Zhang, A. Busnaina, and G. Ahmadi, J. Electrochem. Soc., 146, 2665 (1999).
3. K. Cooper, A. Gupta, and S. Beaudoin, J. Electrochem. Soc., 148, G662 (2001).
4. G. Ahmady and X. Xia, J. Electrochem. Soc., 148, G99 (2001).
5. F. Zhang, A. Busnaina, and D. Rimai, in Proceedings of the 19th Annual Meeting of the Adhesion Society, T. C. Ward, Editor, p. 118, Adhesion Society, Blacksburg, VA (1996).
6. A. Sorooshian, R. Ashwani, H. K. Choi, M. Moinpour, A. Oehler, and A. Tregub, Mater. Res. Soc. Symp. Proc., 816, 125 (2004).
7. G. M. Burdick, N. S. Berman, and S. P. Beaudoin, J. Nanopart. Res., 3, 455 (2001).
8. G. Zhang, G. Burdick, F. Dai, T. Bibby, and S. Beaudoin, Thin Solid Films, 332, 379 (1998).
9. K. Cooper, A. Gupta, and S. Beaudoin, J. Colloid Interface Sci., 234, 284 (2001).
10. (a) J. M. Williams, T. Han, and T. P. Beebe, Langmuir 0743-7463 10.1021/la950500j, 12, 1291 (1996); (b) L. A. Wenzler, G. L. Moyes, L. G. Olson, J. M. Harris, and T. P. Beebe, Anal. Chem., 69, 2855 (1997).
11. (a) J. M. Williams, T. Han, and T. P. Beebe, Langmuir 0743-7463 10.1021/la950500j, 12, 1291 (1996); (b) L. A. Wenzler, G. L. Moyes, L. G. Olson, J. M. Harris, and T. P. Beebe, Anal. Chem., 69, 2855 (1997).
12. Atomic Force Microscopy in Adhesion Studies, J. Drelich, and, K. L. Mittal, Editors, VSP, Leiden (2005).
13. H. Zhoua, M. Götzingera, and W. Peukert, Powder Technol., 135-136, 82 (2003).
14. M. Götzinger and W. Peukert, Langmuir, 20, 5298 (2004).
15. K. Cooper, N. Ohler, A. Gupta, and S. Beadoin, J. Colloid Interface Sci., 222, 63 (2000).
16. K. Cooper, A. Gupta, and S. Beadoin, J. Colloid Interface Sci., 228, 213 (2000).
17. J. J. Valle-Delgado, J. A. Molina-Bolivar, F. Galisteo-Gonzalez, M. J. Galvez-Ruiz, A. Feiler, and M. W. Rutland, J. Chem. Phys., 123, 034708 (2005).
18. Y. Liu, B. Zdyrko, A. Tregub, M. Moinpour, M. Buehler, and I. Luzinov, in Mater. Res. Soc. Symp. Proc., 867, 183 (2005).
19. L. H. G. J. Segeren, B. Siebum, F. G. Karssenberg, J. W. A. van den Berg, and G. J. Vancso, J. Adhes. Sci. Technol., 16, 793 (2002).
20. S. Malynych, I. Luzinov, and G. Chumanov, J. Phys. Chem. B, 106, 1280 (2002).
21. R. Jones, H. M. Pollock, J. A. S. Cleaver, and C. S. Hodges, Langmuir, 18, 8045 (2002).
22. K. L. Chavez and D. W. Hess, J. Electrochem. Soc., 148, G640 (2001).
23. R. K. Singh and S.-M. Lee, U.S. Pat. Appl., 2003016627 (2003).
24. R. K. Singh and S.-M. Lee, U.S. Pat. Appl., 20030159362 (2003).
25. A. Jindala and S. V. Babu, J. Electrochem. Soc., 151, G709 (2004).
26. G. B. Basim, S. C. Brown, I. U. Vakarelski, and B. M. Moudgil, J. Dispersion Sci. Technol., 24, 499 (2003).
27. P.-L. Chen, J.-H. Chen, M.-S. Tsai, B.-T. Dai, and C.-F. Yeh, Microelectron. Eng., 75, 352 (2004).
28. L. M. Mosley and K. A. Hunter, Environ. Sci. Technol., 37, 3303 (2003).
29. Ch.-J. Chin, S. Yacoumi, and C. Tsouris, Environ. Sci. Technol., 36, 343 (2002).
30. R.-H. Yoon, D. H. Flinn, and Y. I. Rabinovich, J. Colloid Interface Sci., 185, 363 (1997).
31. H.-J. Butt, M. Jaschke, and W. Ducker, Bioelectrochem. Bioenerg., 38, 191 (1995).
32. W. A. Ducker and T. J. Senden, Langmuir, 8, 1831 (1992).
33. J. Israelachvili, Intermolecular and Surface Forces, Academic Press, London (1992).
34. A. El Ghzaoui, J. Colloid Interface Sci., 216, 432 (1999).
35. G. Gonzalez and A. M. Travalloni-Louvisse, Langmuir, 5, 26 (1989).
36. Th. F. Tadros, Surfactants, Academic Press, London (1984).
37. V. Subramanian and W. Ducher, J. Phys. Chem. B, 105, 1389 (2001).
38. M. W. Rutland and J. L. Parker, Langmuir, 10, 1110 (1994).
39. J. Stiernstedt, J. C. Fröberg, F. Tiberg, and M. W. Rutland, Langmuir, 21, 1875 (2005).
40. T.-H. Tsai and S.-C. Yen, Appl. Surf. Sci., 210, 190 (2003).
41. T.-H. Tsai and Y.-Fu Wu, Chem. Eng. Commun., 193, 702 (2006).
42. H.-H. Choi, J. Park, and R. K. Singh, Electrochem. Solid-State Lett., 7, C10 (2004).