Products Made from Nonmetallic Materials Reclaimed from Waste Printed Circuit Boards

Tsinghua Science and Technology

Volumn 12, Issue 3, 2007, Pages 276-283

  Mou, Peng ^a   Xiang, Dong ^a   Duan, Guanghong ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

electronic waste; printed circuit boards (PCBs); reclaimation; reusing

Indexed keywords

COMPOSITE BOARDS; ELECTRONIC WASTES; SEWER GRATES; WASTE PROCESSING;

BENDING STRENGTH; DURABILITY; ENVIRONMENTAL PROTECTION; MILLING (MACHINING); NONMETALLIC MATERIALS; RECLAMATION; WASTE UTILIZATION;

PRINTED CIRCUIT BOARDS;

EID: 34447538317     PISSN: 10070214     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1007-0214(07)70041-X     Document Type: Article

References (12)

1. Bernardes A, Bohlinger I, Rodriguez D, Milbrandt H, Wuth W. Recycling of printed circuit boards by melting with oxidising/reducing top blowing process. In: TMS Annual Meeting. Orlando, USA, 1997.
2. Li J., Puneet S., Gao Z., and Zhang H. Printed circuit board recycling: A state-of-the-art survey. IEEE Transaction on Electronics Packaging Manufacturing 27 1 (2004) 33-42
3. Yokoyama S, Iji M. Recycling of thermosetting plastic waste from electronic component production process. In: Proceeding of 1995 IEEE International Symposium on Electronics and the Environment. USA, 1995: 132-137.
4. Yokoyama S, Iji M. Recycling of printed wiring boards with mounted electronic parts. In: Proceeding of 1997 IEEE International Symposium on Electronics and the Environment. USA, 1997: 109-114.
5. Iji M. Recycling of epoxy resin compounds for moulding electronic components. Journal of Materials Science 33 (1998) 45-53
6. Yokoyama S, Iji M. Recycling system for printed wiring boards with mounted parts. In: Proceeding of 1999 Environmentally Conscious Design and Inverse Manufacturing. Tokyo, Japan, 1999: 814-817.
7. Economy J., and Andreopoulos A. A new concept for recycling of thermosetting resin?: The case of crosslinkable copolyesters. Polymer for Advanced Techonologies 7 (1996) 561-570
8. Dang W., Kubouchi M., Yamamoto S., Sembokuya H., and Tsuda K. An approach to chemical recycling of epoxy resin cured with amine using nitric acid. Polymer 43 (2002) 2953-2958
9. Dang W., Kubouchi M., Sembokuya H., and Tsuda K. Chemical recycling of glass fiber reinforced epoxy resin cured with amine using nitric acid. Polymer 46 (2005) 1905-1912
10. Chen J.S., Christopher K., and Mark D. Characterization of thermally reworkable thermosets: Materials for environmentally friendly processing and reuse. Polymer 43 (2002) 131-139
11. Mou Peng, Wa Layiding, Xiang Dong, Gao Jiangang, Duan Guanghong. A physical process for recycling and reusing waste printed circuit boards. In: Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment. Scottsdale, USA, 2004: 237-242.
12. Yi C., Liu J., Zeng J., and Zeng J. Present status and developing trend of compound well lids. FRP and Compound Material 4 (2004) 43-45 (in Chinese)