A physical process for recycling and reusing waste printed circuit boards

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2004, Pages 237-242

  Mou, Peng ^a   Wa, Layiding ^a   Xiang, Dong ^a   Gao, Jiangang ^a   Duan, Guanghong ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Closed loop; Cooling spray; Environmentally sound; Profitable; Recycling; Reusing

Indexed keywords

SHEARING FORCES; TOXIC GASES; ULTRASONIC EDDY CURRENTS;

BENDING STRENGTH; EDDY CURRENTS; ENVIRONMENTAL IMPACT; FILLERS; GLASS FIBERS; RECYCLING; RESINS; SEPARATION; WASTE UTILIZATION;

PRINTED CIRCUIT BOARDS;

EID: 4444347610     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Shunli Zhang, Eric Forssberg, "Mechanical separation-oriented characterization of electronic scrap", Resources, Conservation and Recycling, vol. 21, pp. 247-269, September 1997.
2. B.A.Wills, Mineral processing technology, Great Britain, A.Sheaton & Co.Ltd., Ecter, 1985.
3. Criterion of Sewage Letting of R.P.China, GB8978-1996, Jan 1, 1998.
4. Mashtoshi.IJI, "Recycling of epoxy resin compounds for moulding electronic components", Journal of Materials Science, vol 33, pp45-53, 1998.