Recycling of epoxy resin compounds for moulding electronic components

Journal of Materials Science

Volumn 33, Issue 1, 1998, Pages 45-53

  Iji, Masatoshi ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELECTRONIC EQUIPMENT MANUFACTURE; EPOXY RESINS; PLASTICS FILLERS; PLASTICS MOLDING; POWDERS; SILICA;

ELECTRONIC COMPONENTS; FILLED PLASTICS; MOLDING RESIN POWDERS;

RECYCLING;

EID: 0031698514     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004329209623     Document Type: Article

References (10)

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