Formation of a thermally stable NiSi FUSI gate electrode by a novel integration process

Materials Research Society Symposium Proceedings

Volumn 958, Issue , 2007, Pages 197-204

  Tan, S Y ^a   Chiu, Hsien Chia ^a   Hu, Chun Yen ^a  

^a CHINESE CULTURE UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; DRAIN CURRENT; ELECTRIC CONDUCTIVITY; NICKEL; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; THICKNESS MEASUREMENT; TRANSMISSION ELECTRON MICROSCOPY;

FILM AGGLOMERATION; GATE ELECTRODES; NICKEL SUICIDE;

ELECTRODES;

EID: 34347228147     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. The International Technology Roadmap for Semiconductors, 2005.
2. C.Hobbs et al., VLSI Symp. Tech. Dig., p. 9(2003).
3. K. Shiraishi et al., VLSI Symp. Tech. Dig., p. 108(2004).
4. H. Iwai, T. Ohgura, S. Ohmi, Microelectron. Eng. 60 (2002) 157.
5. A. Hokazono, K. Ohuchi, M. Takayanagi, Y. Watanabe, S. Magoshi, Y. Kato, T. Shimizu, et al., IEDM Tech. Dig. (2002) 639.
6. J.P. Lu, D. Miles, J. Zhao, A. Gurba, Y. Xu, C. Lin, M. Hewson, et al., IEDM Tech. Dig. (2002) 371.
7. A. Lauwers, A. Steegen, M. de potter, R. Lindsay, A. Satta, H. Bender, K. Maex, J. Vac. Sci. Technol., B 19 (2001) 2026.
8. A. Lauwers, M. de Potter, O. Chamirian, R. Lindsay, C. Demeurisse, C. Vrancken, K. Maex, Microelectron. Eng. 64 (2002) 131.
9. K.L Pey, P.S. Lee, D. Mangelinck, Thin Solid Films 462-463 (2004) 137.
10. A.S. Wang, D.Z. Chi, M. Loomans, D. Ma, M.Y. Lai, W.C. Tjiu, S.J. Chua, Appl. Phys. Lett. 81 (2002) 5138.
11. F. Heurle, C.S. Petersson, J.E.E. Baglin, S.J. Placa, C.Y. Wong, J. Appl. Phys. 55 (1984) 4208.
12. J.A. Kittl, A. Lauwers, O. Chamirian, M.A. Pawlak, M. Van Dal, A. Akheyar, M. De Potter, A. Kottantharayil, G. Pourtois, R. Lindsay, K. Maex, Mater. Res. Soc., Symp. Proc. 810 (2004) 31.
13. C. Lavoie, P.M. d'Heurle, C. Detavernier, C. Cabral Jr., Microelectron. Eng. 70 (2003) 144.
14. J.A. Kittl, A. Lauwers, M.A. Pawlak, M. Van Dal, A. Veloso, K.G. Anil, G. Pourtois, C. Demeurisse, T. Schram, B. Brijs, M. De Potter, C. Vrancken, K. Maex, Microelectron. Eng. 82 (2005) 441.