-
1
-
-
4544353205
-
A new dual-band antenna for WLAN applications
-
Jun. 20-25
-
Y.-Y. Wang and S.-J. Chung, "A new dual-band antenna for WLAN applications," in Proc. IEEE AP-S Int. Symp., Jun. 20-25, 2004, vol. 3, pp. 2611-2614.
-
(2004)
Proc. IEEE AP-S Int. Symp
, vol.3
, pp. 2611-2614
-
-
Wang, Y.-Y.1
Chung, S.-J.2
-
2
-
-
33646260678
-
A wideband printed monopole antenna for 2.4-GHz WLAN applications
-
May
-
M. N. Suma, P. C. Bybi, and P. Mohanan, "A wideband printed monopole antenna for 2.4-GHz WLAN applications," Microwave Opt. Technol. Lett., vol. 48, pp. 871-873, May 2006.
-
(2006)
Microwave Opt. Technol. Lett
, vol.48
, pp. 871-873
-
-
Suma, M.N.1
Bybi, P.C.2
Mohanan, P.3
-
3
-
-
9744232208
-
A microstrip-coupled printed inverted-F monopole antenna
-
Dec
-
C.-M. Su, K.-L. Wong, W.-S. Chen, and Y.-T. Cheng, "A microstrip-coupled printed inverted-F monopole antenna," Microwave. Opt. Technol. Lett., vol. 43, pp. 470-472, Dec. 2004.
-
(2004)
Microwave. Opt. Technol. Lett
, vol.43
, pp. 470-472
-
-
Su, C.-M.1
Wong, K.-L.2
Chen, W.-S.3
Cheng, Y.-T.4
-
4
-
-
33645991211
-
Microstripline-fed half-cylindrical dielectric resonator antenna for 2.4-GHz WLAN application
-
Apr
-
A. V. P. Kumar, V. Hamsakutty, J. Yohannan, and K. T. Mathew, "Microstripline-fed half-cylindrical dielectric resonator antenna for 2.4-GHz WLAN application," Microwave. Opt. Technol. Lett., vol. 48, pp. 724-726, Apr. 2006.
-
(2006)
Microwave. Opt. Technol. Lett
, vol.48
, pp. 724-726
-
-
Kumar, A.V.P.1
Hamsakutty, V.2
Yohannan, J.3
Mathew, K.T.4
-
5
-
-
33644985389
-
Design of a planar inverted-F antenna with very wide impedance bandwidth
-
Mar
-
H. Park, K. Chung, and J. Choi, "Design of a planar inverted-F antenna with very wide impedance bandwidth," IEEE Microwave and Wireless Compon. Lett., vol. 16, pp. 113-115, Mar. 2006.
-
(2006)
IEEE Microwave and Wireless Compon. Lett
, vol.16
, pp. 113-115
-
-
Park, H.1
Chung, K.2
Choi, J.3
-
6
-
-
3142770559
-
An internal triple-band planar inverted-F antenna
-
Y.-B.Kwon, J.-I. Moon, and S.-O. Park, "An internal triple-band planar inverted-F antenna," IEEE Antennas Wireless Propag. Lett., vol. 2, pp. 341-344, 2003.
-
(2003)
IEEE Antennas Wireless Propag. Lett
, vol.2
, pp. 341-344
-
-
Kwon, Y.B.1
Moon, J.-I.2
Park, S.-O.3
-
7
-
-
9144244434
-
Enhanced-bandwidth PIFA with T-shaped ground plane
-
Nov
-
F. Wang, Z. Du, Q. Wang, and K. Gong, "Enhanced-bandwidth PIFA with T-shaped ground plane," Electron. Lett., vol. 40, pp. 1504-1505, Nov. 2004.
-
(2004)
Electron. Lett
, vol.40
, pp. 1504-1505
-
-
Wang, F.1
Du, Z.2
Wang, Q.3
Gong, K.4
-
8
-
-
0031700277
-
A single-chip CMOS transceiver for DCS-1800 wireless communications
-
Feb. 5-7
-
M. Steyaert, M. Borremans, J. Janssens, B. Muer, I. Itoh, J. Craninckx, J. Crols, E. Morifuji, S. Momose, and W. Sansen, "A single-chip CMOS transceiver for DCS-1800 wireless communications," in Proc. IEEE Int. Solid-State Circuits Conf., Feb. 5-7, 1998, pp. 48-49.
-
(1998)
Proc. IEEE Int. Solid-State Circuits Conf
, pp. 48-49
-
-
Steyaert, M.1
Borremans, M.2
Janssens, J.3
Muer, B.4
Itoh, I.5
Craninckx, J.6
Crols, J.7
Morifuji, E.8
Momose, S.9
Sansen, W.10
-
9
-
-
0035701608
-
Development of planar antennas in multi-layer packages for RF system-on-a-package applications
-
Oct
-
K. Lim, A. Obatoyinbo, M. Davis, J. Laskar, and R. Tummala, "Development of planar antennas in multi-layer packages for RF system-on-a-package applications," Electrical Perform. Electron. Package, pp. 101-104, Oct. 2001.
-
(2001)
Electrical Perform. Electron. Package
, pp. 101-104
-
-
Lim, K.1
Obatoyinbo, A.2
Davis, M.3
Laskar, J.4
Tummala, R.5
-
10
-
-
1942424832
-
Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers
-
Feb
-
Y. P. Zhang, "Finite-difference time-domain analysis of integrated ceramic ball grid array package antenna for highly integrated wireless transceivers," IEEE Trans. Antennas Propag., vol. 52, no. 2, pp. 435-442, Feb. 2004.
-
(2004)
IEEE Trans. Antennas Propag
, vol.52
, Issue.2
, pp. 435-442
-
-
Zhang, Y.P.1
-
12
-
-
7244230018
-
Integrated circuit ceramic ball grid array package antenna
-
Oct
-
Y. P. Zhang, "Integrated circuit ceramic ball grid array package antenna," IEEE Trans. Antennas Propag., vol. 52, no. 10, pp. 2538-2544, Oct. 2004.
-
(2004)
IEEE Trans. Antennas Propag
, vol.52
, Issue.10
, pp. 2538-2544
-
-
Zhang, Y.P.1
-
13
-
-
0037168135
-
Integration of microstrip antenna on cavity-down ceramic ball grid array package
-
Oct
-
Y. P. Zhang, "Integration of microstrip antenna on cavity-down ceramic ball grid array package," Electron. Lett., vol. 38, pp. 1307-1308, Oct. 2002.
-
(2002)
Electron. Lett
, vol.38
, pp. 1307-1308
-
-
Zhang, Y.P.1
-
14
-
-
84964608861
-
Design of on-package microstrip antennas for single-chip wireless transceivers
-
Dec. 10-12
-
Y. P. Zhang, "Design of on-package microstrip antennas for single-chip wireless transceivers," in Proc. IEEE Electron. Packag. Technol. Conf., Dec. 10-12, 2002, pp. 40-44.
-
(2002)
Proc. IEEE Electron. Packag. Technol. Conf
, pp. 40-44
-
-
Zhang, Y.P.1
-
15
-
-
0141522699
-
Novel RF front end antenna package
-
Aug
-
C. T. P. Song, P. S. Hall, and H. Ghafouri-Shiraz, "Novel RF front end antenna package," in IEE Proc. Microw. Antennas Propag., Aug. 2003, vol. 150, pp. 290-294.
-
(2003)
IEE Proc. Microw. Antennas Propag
, vol.150
, pp. 290-294
-
-
Song, C.T.P.1
Hall, P.S.2
Ghafouri-Shiraz, H.3
-
16
-
-
34250897438
-
-
Pittsburgh, PA: Ansoft Corporation
-
EM simulation tool HFSS. Pittsburgh, PA: Ansoft Corporation.
-
EM simulation tool HFSS
-
-
-
17
-
-
4544337744
-
3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology
-
May
-
M. M. Tentzeris, J. Laskar, J. Papapolymerou, S. Pinel, V. Palazzari, R. Li, G. DeJean, N. Papageorgiou, D. Thompson, R. Bairavasubramanian, S. Sarkar, and J.-H. Lee, "3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technology," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 332-340, May 2004.
-
(2004)
IEEE Trans. Adv. Packag
, vol.27
, Issue.2
, pp. 332-340
-
-
Tentzeris, M.M.1
Laskar, J.2
Papapolymerou, J.3
Pinel, S.4
Palazzari, V.5
Li, R.6
DeJean, G.7
Papageorgiou, N.8
Thompson, D.9
Bairavasubramanian, R.10
Sarkar, S.11
Lee, J.-H.12
-
18
-
-
0036706202
-
A compact LTCC-based Ku-band transmitter module
-
Aug
-
C.-H. Lee, A. Sutono, S. Han, K. Lim, S. Pinel, E. M. Tentzeris, and J. Laskar, "A compact LTCC-based Ku-band transmitter module," IEEE Trans. Adv. Packag., vol. 25, no. 3, pp. 374-384, Aug. 2002.
-
(2002)
IEEE Trans. Adv. Packag
, vol.25
, Issue.3
, pp. 374-384
-
-
Lee, C.-H.1
Sutono, A.2
Han, S.3
Lim, K.4
Pinel, S.5
Tentzeris, E.M.6
Laskar, J.7
-
19
-
-
14844333278
-
Design and implementation of system-on-package for radio and mixed-signal applications
-
Jun.-Jul. 3-7
-
L.-R. Zheng, X. Duo, M. Shen, T. Torrika, W. Michielsen, H. Tenhunen, L. Chen, G. Zou, and J. Liu, "Design and implementation of system-on-package for radio and mixed-signal applications," in Proc. IEEE High Density Microsystem Design and Packaging and Component Failure Analysis Conf., Jun.-Jul. 3-7, 2004, pp. 97-104.
-
(2004)
Proc. IEEE High Density Microsystem Design and Packaging and Component Failure Analysis Conf
, pp. 97-104
-
-
Zheng, L.-R.1
Duo, X.2
Shen, M.3
Torrika, T.4
Michielsen, W.5
Tenhunen, H.6
Chen, L.7
Zou, G.8
Liu, J.9
-
20
-
-
4544226060
-
Electromagnetic interference (EMI) of system-on-package (SOP)
-
May
-
T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak, "Electromagnetic interference (EMI) of system-on-package (SOP)," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 304-314, May 2004.
-
(2004)
IEEE Trans. Adv. Packag
, vol.27
, Issue.2
, pp. 304-314
-
-
Sudo, T.1
Sasaki, H.2
Masuda, N.3
Drewniak, J.L.4
|