Adaptive bonding technique for precise assembly of three-dimensional microstructures

Applied Physics Letters

Volumn 90, Issue 23, 2007, Pages

  Park, Sang Hu ^a   Jeong, Jun Ho ^b   Choi, Dae Geun ^b   Kim, Ki Don ^b   Altun, Ali Ozhan ^b   Lee, Eung Sug ^b   Yang, Dong Yol ^c   Lee, Kwang Sup ^d  

^a Pusan National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^d Hannam University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; PHOTONS; POLYMERIZATION; SUBSTRATES;

CONTACT PRINT LITHOGRAPHY (CPL); TWO-PHOTON INDUCED POLYMERIZATION (TPP);

MICROSTRUCTURE;

EID: 34250782151     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2746085     Document Type: Article

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