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Volumn 237, Issue 1-4, 2004, Pages 457-462

Influence of wet chemical treatments on the evolution of epoxy polymer layer surface roughness for use as a build-up layer

Author keywords

Epoxy polymer; Interface; Roughness

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; DIELECTRIC MATERIALS; EPOXY RESINS; ETCHING; HYSTERESIS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; OXIDATION; POLYMERS; REACTION KINETICS;

EID: 4644238040     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2004.06.111     Document Type: Conference Paper
Times cited : (22)

References (13)
  • 8
    • 4344707367 scopus 로고
    • Seraphim, D.P., Laky, R.C., Li, C.-Y. (Eds.), Mc-Graw-Hill Book Co.
    • P.S. Ho, in: Seraphim, D.P., Laky, R.C., Li, C.-Y. (Eds.), Principles of Electronic Packaging, Mc-Graw-Hill Book Co., 1989, p. 810.
    • (1989) Principles of Electronic Packaging , pp. 810
    • Ho, P.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.