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Materials Transactions

Volumn 45, Issue 3, 2004, Pages 630-636

Some fundamental issues in the use of Zn-containing lead-free solders for electronic packaging

(3) Vaynman, S a Ghosh, G a Fine, M E a

a Northwestern University (United States)

Author keywords

Computational thermodynamics; Fluxes; Lead free solders; Mechanical properties; Wetting angle; Zinc containing solders

Indexed keywords

ATMOSPHERIC HUMIDITY; COMPUTATIONAL METHODS; CONTACT ANGLE; ELECTRONICS PACKAGING; EUTECTICS; FLUXES; MECHANICAL PROPERTIES; MELTING; ORGANOMETALLICS; SOLDERING ALLOYS; SOLIDIFICATION; SUBSTRATES; THERMODYNAMICS; WETTING;

COMPUTATIONAL THERMODYNAMICS; LEAD-FREE SOLDERS; WETTING ANGLE; ZINC-CONTAINING SOLDERS;

ZINC;

EID: 2442589679 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.630 Document Type: Article

Times cited : (21)

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