Structural and physical analysis on MOCVD Ti-Si-N films

Journal of Physics and Chemistry of Solids

Volumn 68, Issue 5-6, 2007, Pages 1046-1051

  Varesi, E ^a,b   Pavia, G ^a   Zenkevich, A ^c   Lebedinskii, Yu ^c   Besana, P ^a   Giussani, A ^a   Modelli, A ^a  

^a STMICROELECTRONICS   (Italy)

^b CNR   (Italy)

^c NATIONAL RESEARCH NUCLEAR UNIVERSITY MEPHI   (Russian Federation)

Author keywords

A. Thin films; D. Microstructure

Indexed keywords

CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MICROSTRUCTURE; NANOCRYSTALS; OXIDATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY;

AMORPHOUS MATRIX; CRYSTALLINE MORPHOLOGY; OXIDE LAYERS;

THIN FILMS;

EID: 34250166146     PISSN: 00223697     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jpcs.2007.03.015     Document Type: Article

References (14)

1. 4-TiN composites prepared by chemical-vapour deposition. J. Mater. Sci. 17 (1982) 1320
2. Sun X., Reid J.S., Kolawa E., and Nicolet M.A. Reactively sputtered Ti-Si-N films. I. Physical properties. J. Appl. Phys. 81 (1997) 656
3. Sun X., Reid J.S., Kolawa E., Nicolet M.A., and Ruiz R. Reactively sputtered Ti-Si-N films. II. Diffusion barriers for Al and Cu metallizations on Si. J. Appl. Phys. 81 (1997) 664
4. 43 oxidation. Thin Solid Films 349 (1999) 1
5. 43. J. Appl. Phys. 85 (1999) 1871
6. 43 thin films with and without pre-annealing. Surf. Coat. Technol. 124 (2000) 162
7. Nicolet M.A. Ternary amorphous metallic thin films as diffusion barriers for Cu metallization. Appl. Surf. Sci 91 (1995) 269
8. Sun X., Kolawa E., Im S., Garland C., and Nicolet M.A. Effect of Si in reactively sputtered Ti-Si-N films on structure and diffusion barrier performance. Appl. Phys. A 65 (1997) 43
9. Program REFLEX by Alain Gibaud, University of Le Mans, France.
10. Joseph S., Eizenberg M., Marcandal C., and Chen L. TiSiN films produced by chemical vapor deposition as diffusion barriers for Cu metallization. J. Vac. Sci. Technol. B 20 (2002) 1471
11. Moulder F., Stickle W.F., Sobol P.E., and Bomben K.D. In: Chastain J. (Ed). Handbook of X-ray Photoelectron Spectroscopy (1993), Perkin-Elmer, Eden Prairie, MN
12. Prieto P., and Kirby R.E. X-ray photoelectron spectroscopy study of the difference between reactively evaporated and direct sputter-deposited TiN films and their oxidation properties. J. Vac. Sci. Technol. A 13 (1995) 2819
13. Christiansen S., Albrecht M., Strunk H.P., and Veprek S. Microstructure of novel superhard nanocrystalline-amorphous composites as analyzed by high resolution transmission electron microscopy. J. Vac. Sci. Technol. B 16 (1998) 19
14. Igasaki Y., Mitsuhashi H., Azuma K., and Muro T. Structure and electrical properties of titanium nitride films. Jpn. J. Appl. Phys. 17 (1978) 85