-
1
-
-
0017268997
-
The concept of frequency separation methods in life prediction for time dependent fatigue
-
Coffin L.F. The concept of frequency separation methods in life prediction for time dependent fatigue. ASME Symposium on Creep Fatigue Interaction (1976) 346-363
-
(1976)
ASME Symposium on Creep Fatigue Interaction
, pp. 346-363
-
-
Coffin, L.F.1
-
3
-
-
85008000357
-
Fatigue crack growth during gross plasticity and J-integral
-
American Society for Testing and Materials, Philadelphia, PA pp. 82-103
-
Dowling N.E., and Begley J.A. Fatigue crack growth during gross plasticity and J-integral. Mechanics of Crack Growth, ASTM STP 590 (1976), American Society for Testing and Materials, Philadelphia, PA pp. 82-103
-
(1976)
Mechanics of Crack Growth, ASTM STP 590
-
-
Dowling, N.E.1
Begley, J.A.2
-
4
-
-
0347956400
-
On constitutive relations and failure criteria of an austenitic steel under cyclic loading at elevated temperature
-
Ponter A.R.S., and Hayhurst D.R. (Eds). Springer-Verlag, Leicester, UK, September 8-12
-
Goodall I.W., Hales R., and Walters D.J. On constitutive relations and failure criteria of an austenitic steel under cyclic loading at elevated temperature. In: Ponter A.R.S., and Hayhurst D.R. (Eds). Proceedings of IUTAM Third Symposium. Springer-Verlag, Leicester, UK, September 8-12 (1980) 103-127
-
(1980)
Proceedings of IUTAM Third Symposium
, pp. 103-127
-
-
Goodall, I.W.1
Hales, R.2
Walters, D.J.3
-
5
-
-
0032731801
-
Low cycle fatigue-dwell effects on high temperature fatigue damage mechanism
-
Goswami T. Low cycle fatigue-dwell effects on high temperature fatigue damage mechanism. Int. J. Fatigue 21 (1999) 55-76
-
(1999)
Int. J. Fatigue
, vol.21
, pp. 55-76
-
-
Goswami, T.1
-
6
-
-
85040265963
-
An engineering approach for elastic-plastic fracture analysis
-
Electric Power Research Institute, Palo Alto
-
Kumar V., German M.D., and Shih C.F. An engineering approach for elastic-plastic fracture analysis. Report No. NP1931 (1981), Electric Power Research Institute, Palo Alto
-
(1981)
Report No. NP1931
-
-
Kumar, V.1
German, M.D.2
Shih, C.F.3
-
7
-
-
85066238732
-
A fracture mechanics approach to creep crack growth
-
American Society for Testing, Materials, Philadelphia, PA pp. 128-148
-
Landes J.D., and Begley J.A. A fracture mechanics approach to creep crack growth. Mechanics of Crack Growth, STP 590 (1976), American Society for Testing, Materials, Philadelphia, PA pp. 128-148
-
(1976)
Mechanics of Crack Growth, STP 590
-
-
Landes, J.D.1
Begley, J.A.2
-
8
-
-
0035364232
-
Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assembles
-
Lau J.H.M., Chang C., and Ricky Lee S.-W. Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assembles. IEEE Trans. Comp. Packaging Technol. 24 2 (2001) 285-292
-
(2001)
IEEE Trans. Comp. Packaging Technol.
, vol.24
, Issue.2
, pp. 285-292
-
-
Lau, J.H.M.1
Chang, C.2
Ricky Lee, S.-W.3
-
9
-
-
0030871137
-
A mechanistic model for fatigue life prediction of solder joints for electronic packaging
-
Lee S.B., and Kim J.K. A mechanistic model for fatigue life prediction of solder joints for electronic packaging. Int. J. Fatigue 19 1 (1997) 85-91
-
(1997)
Int. J. Fatigue
, vol.19
, Issue.1
, pp. 85-91
-
-
Lee, S.B.1
Kim, J.K.2
-
10
-
-
84915181981
-
Advances in creep mechanics
-
Ponter A.R.S., and Hayhurst D.R. (Eds). Springer-Verlag, Leicester, UK, September 8-12
-
Leckie F.A. Advances in creep mechanics. In: Ponter A.R.S., and Hayhurst D.R. (Eds). Creep in Structures, Proceedings of IUTAM Third Symposium. Springer-Verlag, Leicester, UK, September 8-12 (1980) 13-47
-
(1980)
Creep in Structures, Proceedings of IUTAM Third Symposium
, pp. 13-47
-
-
Leckie, F.A.1
-
11
-
-
0015200072
-
Creep-fatigue analysis by strain-range partitioning
-
Zamrik S.Y. (Ed), ASME, New York
-
Manson S.S., Halford G.R., and Hirschberg M.H. Creep-fatigue analysis by strain-range partitioning. In: Zamrik S.Y. (Ed). Proceedings of Symposium on Design for Elevated Temperature Environment (1971), ASME, New York 12-28
-
(1971)
Proceedings of Symposium on Design for Elevated Temperature Environment
, pp. 12-28
-
-
Manson, S.S.1
Halford, G.R.2
Hirschberg, M.H.3
-
12
-
-
85115243338
-
Cumulative damage in fatigue
-
Miner M.A. Cumulative damage in fatigue. J. Appl. Mech. 12 (1945) 159-164
-
(1945)
J. Appl. Mech.
, vol.12
, pp. 159-164
-
-
Miner, M.A.1
-
13
-
-
0034224375
-
A model for creep-fatigue interaction in terms of crack-tip stress relaxation
-
Oh Y.J., Nam S.W., and Hong J.H. A model for creep-fatigue interaction in terms of crack-tip stress relaxation. Metall. Mater. Trans. A 31A (2000) 1761-1775
-
(2000)
Metall. Mater. Trans. A
, vol.31 A
, pp. 1761-1775
-
-
Oh, Y.J.1
Nam, S.W.2
Hong, J.H.3
-
14
-
-
0019105728
-
Tensile cracks in creeping solids
-
American Society for Testing and Materials, Philadelphia, PA
-
Riedel H., and Rice J.R. Tensile cracks in creeping solids. Fracture Mechanics, 12th Conference, Special Technical Publication 700 (1980), American Society for Testing and Materials, Philadelphia, PA 112-130
-
(1980)
Fracture Mechanics, 12th Conference, Special Technical Publication 700
, pp. 112-130
-
-
Riedel, H.1
Rice, J.R.2
-
15
-
-
34249896256
-
-
Saxena, A., Williams, R.S., Shih, T.T., 1979. A model for representing and predicting the influence of hold time on the fatigue crack growth behavior at elevated temperature. Scientific Paper 79-1D3-EVFLA-P3. R&D Center, Westinghouse, Pittsburgh.
-
-
-
-
16
-
-
0033875279
-
Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy
-
Shi X.Q., Pang H.L.J., Zhou W., and Wang Z.P. Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy. Int. J. Fatigue 22 (2000) 217-228
-
(2000)
Int. J. Fatigue
, vol.22
, pp. 217-228
-
-
Shi, X.Q.1
Pang, H.L.J.2
Zhou, W.3
Wang, Z.P.4
-
17
-
-
0030171903
-
Energy approach to the fatigue of 60/40 solder. Part 2. Influence of hold time and asymmetric loading
-
Solomon H.D., and Tolksdorf E.D. Energy approach to the fatigue of 60/40 solder. Part 2. Influence of hold time and asymmetric loading. ASME: J. Electron. Packaging 118 6 (1996) 67-71
-
(1996)
ASME: J. Electron. Packaging
, vol.118
, Issue.6
, pp. 67-71
-
-
Solomon, H.D.1
Tolksdorf, E.D.2
-
18
-
-
0344182469
-
Effect of hold time on low cycle fatigue behavior of nitrogen bearing 316L stainless steel
-
Srinivasan V.S., Nagesha A., Valsan M., Bhanu Sankara Rao K., Mannan S.L., and Sastry D.H. Effect of hold time on low cycle fatigue behavior of nitrogen bearing 316L stainless steel. Int. J. Pres. Ves. Pip. 76 (1999) 863-870
-
(1999)
Int. J. Pres. Ves. Pip.
, vol.76
, pp. 863-870
-
-
Srinivasan, V.S.1
Nagesha, A.2
Valsan, M.3
Bhanu Sankara Rao, K.4
Mannan, S.L.5
Sastry, D.H.6
-
19
-
-
0032710560
-
High temperature time dependent low cycle fatigue behavior of a type 316L(N) stainless steel
-
Srinivasan V.S., Valsan M., Sandhya R., Bhanu Sankara Rao K., Mannan S.L., and Sastry D.H. High temperature time dependent low cycle fatigue behavior of a type 316L(N) stainless steel. Int. J. Fatigue 21 (1999) 11-21
-
(1999)
Int. J. Fatigue
, vol.21
, pp. 11-21
-
-
Srinivasan, V.S.1
Valsan, M.2
Sandhya, R.3
Bhanu Sankara Rao, K.4
Mannan, S.L.5
Sastry, D.H.6
-
20
-
-
0035452425
-
Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder
-
Zhao J., Miyashita Y., and Mutoh Y. Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder. Int. J. Fatigue 23 (2001) 723-731
-
(2001)
Int. J. Fatigue
, vol.23
, pp. 723-731
-
-
Zhao, J.1
Miyashita, Y.2
Mutoh, Y.3
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