Localized etching of an insulator film coated on a copper wire using an atmospheric-pressure microplasma jet

Review of Scientific Instruments

Volumn 78, Issue 4, 2007, Pages

  Yoshiki, Hiroyuki ^a  

^a TSURUOKA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; COPPER; ELECTRODES; ETCHING; FLUORESCENCE MICROSCOPY; NOZZLES; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; WIRE;

COPPER MONOXIDE; GAS NOZZLES; INSULATOR FILMS; MICROPLASMA JETS; SCANNING ELECTRON MICROSCOPES;

THIN FILMS;

ARGON; COPPER; OXYGEN;

ARTICLE; CHEMISTRY; FLUORESCENCE MICROSCOPY; PRESSURE; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTY;

ARGON; COPPER; MICROSCOPY, ELECTRON, SCANNING; MICROSCOPY, FLUORESCENCE; OXYGEN; PRESSURE; SURFACE PROPERTIES;

EID: 34247643332     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2727488     Document Type: Article

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