Adhesion and adhesion changes at the copper metal-(acrylonitrile-butadiene-styrene) polymer interface

Thin Solid Films

Volumn 515, Issue 17, 2007, Pages 6853-6859

  Kisin, S ^a   van der Varst, P G Th ^a   de With, G ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Adhesion; Copper polymer interface; Peel test; Storage time

Indexed keywords

ABS RESINS; ADHESION; COPPER; DEPOSITION; INTERFACES (MATERIALS); PEELING;

ADHESIVE STRENGTH; COPPER-POLYMER INTERFACES; GALVANIC DEPOSITION; STORAGE TIME;

POLYMER FILMS;

EID: 34247607708     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.02.018     Document Type: Article

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