MEMS packaging issues and materials

Advancing Microelectronics

Volumn 27, Issue 6, 2000, Pages 9-13

  Gilleo, Ken ^a  

^a Assembly Materials Group   (United States)

Author keywords

Getters; MEMS; MOEMS; Packaging; Parylene; Stiction

Indexed keywords

EID: 77949660898     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. Gilleo, K., "MEMS Packaging Solutions", pp. 49, 50, 52, 53, 55, 56, EP & P.June 2000.
2. Mignardi, M., "From ICs to DMDs", TI Technical Journal, pp. 56 - 63, July - Sept. 1998 (http://www.TI.com).
3. Miller, W. M., "MEMS Reliability and Testing", IMAPS Packaging of MEMS Microsystems Workshop, Chicago, Oct. 23 - 24, 1999.
4. Martin, J. and Zhao, Y., "Micromachined Devices Packaged to Reduce Stiction", US. Patent 5,694,740, Dec. 9, 1997.