Using via fences for crosstalk reduction in PCB circuits

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2006, Pages 34-37

  Suntives, Asanee ^a   Khajooeizadeh, Arash ^a   Abhari, Ramesh ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

Coupled PCB microstrip; Crosstalk; Guard trace; Signal integrity; Via fence

Indexed keywords

COMPUTER SIMULATION; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS; MICROSTRIP LINES; PRINTED CIRCUIT BOARDS;

COUPLED PCB MICROSTRIPS; GUARD TRACE; SIGNAL INTEGRITY; VIA FENCE;

CROSSTALK;

EID: 34047200156     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/isemc.2006.1706258     Document Type: Conference Paper

References (8)

1. K. L. Tai, "System-in-package (SIP): challenges and opportunities," in Proc. Asia-South Pacific Design Automation Conf., Yokohama, Japan, Jan. 25-28, 2000, pp. 191-196.
2. R. R. Tummala, M. Swaminathan, M. M. Tentzeris, J. Laskar, G.-K. Chang, S. Sitaraman, D. Keezer, D. Guidotti, Z. Huang, K. Lim, L. Wan, S. K. Bhattacharya, V. Sundaram, F. Liu, and P. M. Raj, "The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade," IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 250-267, May 2004.
3. I. Novak, B. Eged, and L. Hatvani, "Measurement by vector-network analyzer and simulation of crosstalk reduction on printed circuit boards with additional center traces," in Proc. IEEE Instrumentation and Measurement Technology (IMTC), Irvine, CA, May 18-20, 1993, pp. 269-274.
4. D. S. Britt, D. M. Hockanson, F. Sha, J. L. Drewniak, T. H. Hubing, and T. P. V. Doren, "Effects of gapped groundplanes and guard traces on radiated EMI," in Proc. IEEE Electromagnetic Compatibility (EMC), Austin, TX, Aug. 18-22, 1997, pp. 159-164.
5. L. Zhi, W. Qiang, and S. Changsheng, "Application of guard traces with vias in the rf pcb layout," in Proc. IEEE International Symposium on Electromagnetic Compatibility (EMC), May 21-24, 2002, pp. 771-774.
6. G. E. Ponchak, D. Chun, J.-G. Yook, and L. P. B. Katehi, "The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages," IEEE Trans. Adv. Packag., vol. 23, no. 1, pp. 88-99, Feb. 2000.
7. F.-J. Pajares, M. Ribó, J.-R. Regué, P. Rodriguez-Cepeda, and L. Pradell, "A multimodal analysis of the effects of guard traces over near wideband signal paths," in Proc. IEEE Electromagnetic Compatibility (EMC), Chicago, IL, Aug. 8-12, 2004, pp. 933-936.
8. A. Suntives and R. Abhari, "Characterizations of interconnects formed in electromagnetic bandgap substrates," in Proc. 9th IEEE Workshop Signal Propagation on Interconnects (SPI), Garmisch-Partenkirchen, Germany, May 10-13, 2005, pp. 75-78.