Packaging and MMIC design for low cost mm-wave modules

IET Seminar Digest

Volumn 2006, Issue 11593, 2006, Pages 50-53

  Powell, J R ^a   Munday, P D ^a  

^a QINETIQ   (United Kingdom)

Author keywords

MM wave; Organic; Packaging MMIC; Substrate

Indexed keywords

COMPUTER SIMULATION; MILLIMETER WAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RADIO LINKS;

MM-WAVE MODULES; QINETIQ (CO); SUBSTRATE COSTS;

ELECTRONICS PACKAGING;

EID: 34047113400     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ic:20060108     Document Type: Conference Paper

References (16)

1. GaAs pHEMT, see for example: http://www.st.northropgrumman.com/ velocium/foundry.html, http://ums.openkast.com/ums/home/home_page.php, http://www.triquint.com/prodserv/foundry
2. GaAs mHEMT, see for example: http://www.winfoundry.com/, http://www.ommic.com/FS/FS_foundry_main.htm
3. InP HEMT, see for example; http://www.st.northropgrumman.com/velocium/ foundry.html http://www.hrl.com/HRL, http://www.elec.gla.ac.uk/groups/nano/ UFS/
4. SiGe, see for example: http://www.infineon.com
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