MMIC and module design and performance for millimetric transceiver front-ends for transport applications

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2006, Pages 1497-1500

  Powell, J R ^a   Munday, P D ^a   Tang, W H A ^a   Hunt, R C ^b   Gunton, D J ^b  

^a QINETIQ   (United Kingdom)

^b BAE SYSTEMS   (United Kingdom)

Author keywords

Integrated circuit packaging; Millimeter wave communications; MIMICs; Mobile communication

Indexed keywords

CODES (STANDARDS); FREQUENCY BANDS; INTEGRATED CIRCUITS; MILLIMETER WAVES; MOBILE TELECOMMUNICATION SYSTEMS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE;

INTEGRATED CIRCUIT PACKAGING; MILLIMETER WAVE COMMUNICATIONS; MODULE DESIGN;

TRANSCEIVERS;

EID: 33847369361     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2006.249576     Document Type: Conference Paper

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