Novel organic SMD package for high-power millimeter wave MMICs

Conference Proceedings- European Microwave Conference

Volumn 1, Issue , 2004, Pages 357-360

  Van Heijningen, M ^a   Friday, J ^b  

^a TNO   (Netherlands)

^b Labtech Limited   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETISM; ELECTRONICS PACKAGING; HEAT RESISTANCE; INDUCTANCE; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POWER AMPLIFIERS;

BONDWIRE COMPENSATION; COMPENSATION CIRCUITS; PACKAGE SUBSTRATES; PARASITIC GROUND INDUCTANCE;

SURFACE MOUNT TECHNOLOGY;

EID: 18744416341     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. K. Beilenhoff, P. Quentin, S. Tranchant, O. Vaudescal, M. Parisot and H. Daembkes, "Full 26 GHz Chipset for Telecom Applications in SMD-Type Packages", Proc. European Gallium Arsenide and other Semiconductors Application Symp. (GAAS2002), pp. 331-334, Sep. 2002.
2. H.C. Huang, A. Ezzeddine, A. Darwish, B. Hsu, J. Williams, S. Peak, "Ku-Band MMICs in Low-Cost, SMT Compatible Packages", IEEE MTT-S Int. Microwave Symp. Dig., vol. 1, pp. 27-30, 2002.
3. S. Morioka, Y. Sawa, "Surface mount package for high frequency band", Proc. Asia Pacific Microwave Conference, pp. 958-961, Dec. 1999.
4. M.P.R. Panicker, "Microwave and millimeter wave ball grid array (BGA) packages", Proc. IEEE 7th topical Meeting on Electrical Performance of Electronic Packaging, pp. 233-236, Oct. 1998
5. A. Bessemoulin, M. Parisot and M. Camiade, "1-Watt Kuband Power Amplifier MMICs using Low-cost Quad-Flat Plastic Package", IEEE MTT-S Int. Microwave Symp. Dig., pp. 473-476, 2004.