Hygrothermal stability of electrical contacts made from silver and graphite electrically conductive pastes

Journal of Electronic Materials

Volumn 36, Issue 1, 2007, Pages 65-74

  Wang, Shoukai ^a   Pang, Dick S ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Carbon fiber composite; Copper; Electrical contact; Electrical resistance; Electrically conductive paste; Graphite colloid; Hygrothermal stability; Joint; Silver epoxy; Silver paint; Tin

Indexed keywords

ELECTRICALLY CONDUCTIVE PASTES; GRAPHITE COLLOIDS; HYGROTHERMAL STABILITY; SILVER EPOXIES; SILVER PAINTS;

ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; EPOXY RESINS; GRAPHITE; PROTECTIVE COLLOIDS; SILVER; THERMODYNAMIC STABILITY;

ELECTRIC CONTACTS;

EID: 33947517858     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0018-z     Document Type: Article

References (23)

1. K.N. Tu, Mater. Chem. Phys. 46, 217 (1996).
2. K. Tsutsumi, M. Kohara, H. Shibata, and H. Nakata, Int. J. Hybrid Microelectron. 1, 38 (1984).
3. K.D. Kim and D.D.L. Chung, J. Electron. Mater. 31, 933 (2002).
4. T. Inada and C.P. Wong, Proc. Int, Symp. Adv. Packaging Materials: Processes, Properties and Interfaces, 4th ed. (1998).
5. C.-K. Leong and D.D.L. Chung, J. Electron. Mater. 33, 203 (2004).
6. J.M. Mayor, L.A. Angurel, R. Navarro, and L. Garcia-Tabares, Institute of Physics Conf. Series (1997), vol. 158 (Applied Superconductivity, 1997, vol. 2) (Institute of Physics Publishing), pp. 1627-1630.
7. D. Ravichandran, F.P. Xavier, P. Francis, S. Sasikala, and S.M. Babu, Bull. Mater. Sci. 19, 437 (1996).
8. A. Salmeron-Valverde, J.G. Robles-Martinez, J. Juarez-Posadas, A. Galindo-Guzman, and A. Zehe, Cryst. Res. Technol. 28, 881 (1993).
9. S.K. Kang and S. Purushothaman, J. Electron. Mater. 28, 1314 (1999).
10. V. Krishnamurthy, K. Paik, and D. Lester, Proc. SPIE - The International Society for Optical Engineering (1992), p. 1847. (Proc. 1992 Int. Symp. on Microelectronics, pp, 719-724.).
11. F.C. Krebs, J. Alstrup, H. Spanggaard, K. Larsen, and E. Kold, Solar Energy Mater. Solar Cells 83, 293 (2004)-300.
12. W.F. Anderson, J. Martinez, and A.H. Madjid, Rev. Sci. Instrum. 41, 1724 (1970).
13. Japan Kokai Tokkyo Koho (1983), JP 58101167 A2 19830616 Showa, 4 pp.
14. I. Kubelik and A. Triska, Phys. Status Solidi A: Appl. Res. 31, K107 (1975).
15. S. Wang and D.D.L. Chung, Carbon 44, 2739 (2006).
16. S. Wang, D. Wang, D.D.L. Chung, and J.H. Chung, J. Mater. Sci. 41, 2281 (2006).
17. S. Wang, D.D.L. Chung, and J.H. Chung, Compos.: Part A 36, 1707 (2005).
18. S. Wang, D.D.L. Chung, and J.H. Chung, J. Mater. Sci. 40, 561 (2005).
19. G.Z. Xiao and M.E.R. Shanahan, J. Polymer Sci., Part B: Polymer Phys. 35, 2659 (1997).
20. G.Z. Xiao and M.E.R. Shanahan, Polymer 39, 3253 (1998).
21. G.Z. Xiao and M.E.R. Shanahan, J. Appl. Polymer Sci. 69, 363 (1998).
22. X. Luo and D.D.L. Chung, J. Mater. Sci. 34, 273 (1999).
23. K.D. Kim and D.D.L. Chung, J. Adh. Sci. Technol. 1911, 1003 (2005).