Pressure Electrical Contact Improved by Carbon Black Paste

Journal of Electronic Materials

Volumn 33, Issue 3, 2004, Pages 203-206

  Leong, Chia Ken ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Carbon black; Electrical contact; Graphite; Pressure contact; Silver; Solder

Indexed keywords

CARBON BLACK; COLLOIDAL GRAPHITE; COPPER; ELECTRIC CONDUCTIVITY; PAINTING; POLYETHYLENE GLYCOLS; SILVER; SOLDERING;

CARBON BLACK PASTE; COPPER SURFACES; ELECTRICAL CONTACT; PRESSURE CONTACT;

ELECTRIC CONTACTS;

EID: 1842427301     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0180-0     Document Type: Article

References (11)

1. K. Kshonze, B.A. Syrett, and R. Khalil, 23rd Annual Connector Interconnection Technology Symp. (Deerfield, IL: International Institute of Connector and Interconnection Technology, Inc., 1990), pp. 191-198.
2. R.J. Russell, Electron. Packaging Prod. 20, 182 (1980).
3. P. Wakeman, K. Billett, R. Irons, and M. Evans, Proc. 14th Ann. Appl. Power Electron. Conf. Expo. 1, 312 (1999).
4. M. Kuribayashi and M. Taguchi, Electron. Comm. Jpn. 67, 90 (1984).
5. X. Luo and D.D.L. Chung, J. Mater. Sci. 35, 4795 (2000).
6. R. Martens, M. Osterman, and D. Haislet, Circuit World 23, 5 (1997).
7. C.-K. Leong and D.D.L. Chung, Carbon 41, 2459 (2003).
8. N. Probst and E. Grivei, Carbon 40, 201 (2002).
9. D. Grivas, D. Frear, L. Quan, and J.W. Morris Jr., J. Electron. Mater. 15, 355 (1986).
10. K.N. Tu, Mater. Chem. Phys. 46, 217 (1996).
11. K. Tsutsumi, M. Kohara, H. Shibata, and H. Nakata, Int. J. Hybrid Microelectron. 7, 38 (1984).