Evaluation of die stress in MEMS packaging: Experimental and theoretical approaches

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 4, 2006, Pages 735-742

  Walwadkar, Satyajit S ^a,b   Cho, Junghyun ^a  

^a State University of New York   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Adhesives; Die stress; Die attach; Finite element analysis (FEA); Microelectromechanical system (MEMS) packaging; Profilometer; Simulation; Warpage

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MEMS; PROFILOMETRY; SENSORS;

DIE ATTACH; DIE STRESS; DIE WARPAGE; INERTIAL SENSORS; MICROELECTROMECHANICAL SYSTEM (MEMS) PACKAGING; WARPAGE;

ELECTRONICS PACKAGING;

EID: 33947232735     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.885931     Document Type: Article

References (22)

1. S. M. Spearing, "Materials issues in micro-mechanical systems (MEMS)," Acta Mater., vol. 48, pp. 179-196, 2000.
2. J. J. Sniegowski and M. P. de Boer, "IC-compatible polysilicon surface micro-machining," Annu. Rev. Mater. Sci., vol. 30, pp. 299-333, 2000.
3. L. Cao, S. Mantell, and D. Polla, "Design and simulation of an implantable medical drug delivery system using micromechanical systems technology," Sens. Act. A, vol. 94, no. 1-2, pp. 117-125, 2001.
4. P. H. Tsao and A. S. Voloshin, "Manufacturing stresses in the die due to the die attach process," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 18, no. 1, pp. 201-205, Mar. 1995.
5. S. Walwadkar, P. W. Farrell, L. E. Felton, and J. Cho, "Effect of die-attach adhesives on the stress evolution in MEMS packaging," in Proc. 36th Int. Symp. Microelectron. (IMAPS'03), Boston, MA, Nov. 2003, pp. 847-852.
6. S. Walwadkar, J. Cho, P. W. Farrell, and L. E. Felton, "Tailoring of stress development in MEMS packaging systems," in Proc. NEMS MEMS Mol. Mach., Warrendale, PA, 2003, vol. 741, pp. 139-144.
7. B. Bowe and V. Toal, "White light interferometric surface profiler," Opt. Eng., vol. 37, no. 6, pp. 1796-1799, 1998.
8. M. L. Kniffin and M. Shah, Int. J. Microcirc. Electron. Packag., vol. 19, no. 1, pp. 75-86, 1996.
9. A. Morrissey et al., "Selection of materials for reduced stress packaging of a microsystem," Sens. Actuators, vol. 74, pp. 178-181, 1999.
10. J. W. Dally and W. F. Riley, Experimental Stress Analysis, 3rd ed. New York: McGraw-Hill, 1991.
11. E. E. Sechler, Elasticity in Engineering. New York: Dover, 1968.
12. "ANSYS Theory Manual," ANSYS, Inc., Houston, PA, 2001.
13. E. Suhir, "An approximate analysis of stresses in multilayered elastic thin films," J. Appl. Mech., vol. 55, pp. 143-148, 1998.
14. W. T. Chen and C. W. Nelson, "Thermal stresses in bonded joints," IBM J. Res. Develop., vol. 23, no. 2, pp. 179-188, 1979.
15. T. Y. Pan and Y. H. Pao, "Deformation in multilayered stacked assemblies," J. Electron. Packag., vol. 112, pp. 30-34, 1990.
16. S. B. Park et al., "Predictive model for optimized design parameters in flip chip packages," in Proc. Int. Soc. Conf. Thermal Phenom., 2004, pp. 458-464.
17. S. S. Walwadkar, "Tailoring of Stress Development in MEMS Packages," M.S. thesis, State Univ. New York, Binghamton, 2004.
18. E. Suhir, "Die attachment design and its influence on thermal stresses in the die and the attachment," in Proc. IEEE/Electron. Ind. Assoc. (EIA) 37th Electron. Comp. Conf., 1987, pp. 133-138.
19. S.Timoshenko,"Analysisof Bi-metal thermostats," J. Opt. Soc. Amer., vol. 11. pp. 233-255, 1925.
20. J. C. Bolger, "Polyimide die attach adhesive for LSI ceramic packages," in Proc. 14th Nat. SAMPE Tech. Conf., 1982, vol. 1, pp. 257-266.
21. J. C. Bolger and C. T. Mooney, "Failure mechanisms for epoxy die attach adhesives in plastic encapsulated I.C.'s," in Proc. Electron. Comp Conf., 1983, pp. 227-231.
22. F. K. Moghdam, "Development of adhesive die attach technology in CERDIP packages," in Proc. Int. Microelectron. Symp., 1983, pp. 79-87.